Tummala rao (72 resultados)

Condición: New.

Hardcover. Condición: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Condición: Very Good. : Este exhaustivo manual de tres volúmenes, revisado y actualizado, sigue siendo la referencia estándar en el campo de la microelectrónica. Ofrece lo último en métodos de diseño, herramientas de modelado, técnicas de simulación y procedimientos de fabricación. A diferencia de otros libros que se centran solo en algunos aspectos del embalaje de microelectrónica, esta obra analiza los paquetes de última generación que cumplen con los requisitos de potencia, refrigeración, protección e interconexión de circuitos cada vez más densos y rápidos. Con un excelente equilibrio entre teoría y aplicaciones prácticas, esta dinámica recopilación presenta ejemplos paso a paso y datos técnicos vitales, simplificando cada fase del diseño y la producción de paquetes. Además, los volúmenes contienen más de 2000 referencias, 900 figuras y 250 tablas. EAN: 9780412084515 Tipo: Libros Categoría: Tecnología Título: Microelectronics Packaging Handbook Autor: Rao Tummala| Eugene J. Rymaszewski| Alan G. Klopfenstein Idioma: en Páginas: 662 Formato: Tapa dura.…

Hardcover. Condición: UsedVeryGood. Hardback with dust jacket. Light shelf wear to exterior; discard stamp on e xterior bottom page edge; former owner's name blacked out at top of exterio r page edge; former owner's name written on front end page; otherwise in ve ry good condition with clean text, firm binding. Dust jacket, light fading, light shelf wear. …

Hard Cover. Condición: Fine. Estado de la sobrecubierta: No Jacket (As Issued). Previous Owner Markings (Name Neatly Inked to Front Free Endpaper); Spine, Boards Bumped; Light Shelf Rub to Boards; Spine Slightly Cocked; Edges Lightly Soiled; Slight Yellowing Due to Age. BOOK NUMBER: 022100. CONTENTS: Preface; Chapter 1. Analysis of Sets and Functions; Chapter 2. Fundamental Concepts of Probability Theory; Chapter 3. Random Variables and Probability Distributions; Chapter 4. Some Discrete Probability Distributions; Chapter 5. Some Continuous Probability Distributions; Chapter 6. Utility and Subjective Probability; Chapter 7. Structure of Decision Analysis Models; Chapter 8. Decision Analysis Under Certainty; Chapter 9. Decision Analysis Under Uncertainty When the Prior Probability Function is Not Known; Chapter 10. Single-Stage Decision Analysis; Chapter 11. Multistage Decision Analysis; Chapter 12. Decision Analysis with Sampling; Chapter 13. Decision Analysis with Sampling When Sample Observations are Discrete; Chapter 14. Decision Analysis with Sampling When Sample Observations are Continuous; Chapter 15. Decision Analysis Approach to Estimation Problems; Chapter 16. Decision Analysis Approach to Testing Hypothesis Problems; Chapter 17. Decision Analysis Approach to Regression Problems; Chapter 18. Conclusion; Appendix; Glossary; Answers to Selected Problems; Index. EXCERPT: Preface - . . . The text begins by developing the concepts of set theory and probability theory (Chapters 1 to 5). These concepts are then used to establish a classification of decision analysis models. The remainder of the book deals with the detailed development and analysis of decision and inference problems. For example, axiomatic development of utility and subjective probability is covered in Chapter 6. Decision analysis models under uncertainty, single-stage, multi-stage, game theory, and decision analysis with sampling are presented in Chapters 9 to 12. Even though the main objective of this textbook is to study decision problems under uncertainty, one chapter is allocated to decision problems under conditions of certainty, e.g., analysis of investment decisions and linear programming, in order to present, in a sense, the other side of the coin. In the concluding chapters certain well-known traditional techniques, such as estimation, hypothesis testing, and regression analysis, are studied from the point of view of the decision analysis approach . . . Size: 8vo - over 7¾" - 9¾" tall. …

Condición: good. The book has been read but is in good condition. It has very minimal damage to the cover, including scuff marks, but no holes or tears. The dust jacket for hard covers may not be included. The binding has minimal wear. The majority of pages are undamaged with minimal creasing or tearing, minimal pencil underlining of text, no highlighting of text, and no writing in the margins. There are no missing pages. See the seller's listing for full details and a description of any imperfections.…

Hard cover. Condición: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.

Hardcover. Condición: New. In shrink wrap. Looks like an interesting title.

paperback. Condición: Very Good. Very Good. Dust Jacket may NOT BE INCLUDED.CDs may be missing. SHIPS FROM MULTIPLE LOCATIONS. book.

Condición: As New. Unread book in perfect condition.

Condición: New.

Condición: New.

Condición: New.

Condición: As New. Unread book in perfect condition.

Condición: New.

Condición: New. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within.

hardcover. Condición: Good.

hardcover. Condición: Very Good. Cover and edges may have some wear.

Condición: New.

Condición: New. System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. This book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this packag.

Condición: New.

Hardcover. Condición: new. New Copy. Customer Service Guaranteed.

Condición: New.

Hardback. Condición: Very Good. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product.A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practicesThis thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore?s Law for packaging, as Moore?s Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore?s Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore?s Law for ICs. This book lays the groundwork for Moore?s Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with.…

Condición: New. pp. 312.

Condición: New.

Condición: New.

Condición: New. pp. 752 2nd Edition.

Condición: New. pp. 664 2nd Edition.

Hardback. Condición: Very Good. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product.A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practicesThis thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore?s Law for packaging, as Moore?s Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore?s Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore?s Law for ICs. This book lays the groundwork for Moore?s Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with.…