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Electronic Packaging for High Reliability, Low Cost Electronics: 57 (NATO Science Partnership Subseries: 3) - Tapa dura
Sinopsis
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
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Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
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Electronic Packaging for High Reliability, Low Cost Electronics: Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 (NATO Science Partnership Sub-Series: 3)
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Kluwer Academic Publishers, 2000
ISBN 10: 0792352181
ISBN 13: 9780792352181
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Electronic Packaging for High Reliability, Low Cost Electronics
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Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within. Nº de ref. del artículo: 5968575
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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
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Electronic Packaging for High Reliability : Low Cost Electronics
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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
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Electronic Packaging for High Reliability, Low Cost Electronics
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Springer Netherlands, Springer Netherlands, 2000
ISBN 10: 0792352181
ISBN 13: 9780792352181
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Librería: AHA-BUCH GmbH, Einbeck, Alemania
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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. Nº de ref. del artículo: 9780792352181
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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
Librería: California Books, Miami, FL, Estados Unidos de America
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Electronic Packaging for High Reliability, Low Cost Electronics
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Springer Netherlands, Springer Netherlands Feb 2000, 2000
ISBN 10: 0792352181
ISBN 13: 9780792352181
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
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Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 312 pp. Englisch. Nº de ref. del artículo: 9780792352181
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Electronic Packaging for High Reliability : Low Cost Electronics
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
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Condición: As New. Unread book in perfect condition. Nº de ref. del artículo: 756013
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Electronic Packaging for High Reliability, Low Cost Electronics
Publicado por
Springer Netherlands Feb 2000, 2000
ISBN 10: 0792352181
ISBN 13: 9780792352181
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. 312 pp. Englisch. Nº de ref. del artículo: 9780792352181
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