Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 164,59
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 178,02
Cantidad disponible: 15 disponibles
Añadir al carritoCondición: New.
Librería: California Books, Miami, FL, Estados Unidos de America
EUR 180,38
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 164,56
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 210,46
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. pp. 328.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 212,22
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. pp. 312.
Librería: preigu, Osnabrück, Alemania
EUR 140,00
Cantidad disponible: 5 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Electronic Packaging for High Reliability, Low Cost Electronics | R. R. Tummala (u. a.) | Taschenbuch | x | Englisch | 2010 | Springer | EAN 9789048150854 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Idioma: Inglés
Publicado por Kluwer Academic Publishers, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 201,68
Cantidad disponible: 15 disponibles
Añadir al carritoCondición: New. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Editor(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko. Series: NATO Science Partnership Subseries: 3. Num Pages: 306 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 1360. . 2000. Hardback. . . . .
Idioma: Inglés
Publicado por Springer Netherlands, Springer, 2010
ISBN 10: 904815085X ISBN 13: 9789048150854
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 168,73
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
Idioma: Inglés
Publicado por Springer Netherlands, Springer Netherlands, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 168,73
Cantidad disponible: 1 disponibles
Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 239,36
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: Brand New. 296 pages. 9.25x6.10x0.70 inches. In Stock.
Idioma: Inglés
Publicado por Kluwer Academic Publishers, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Librería: Kennys Bookstore, Olney, MD, Estados Unidos de America
EUR 253,15
Cantidad disponible: 15 disponibles
Añadir al carritoCondición: New. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Editor(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko. Series: NATO Science Partnership Subseries: 3. Num Pages: 306 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 1360. . 2000. Hardback. . . . . Books ship from the US and Ireland.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 244,76
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 235,22
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Like New. Like New. book.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 269,03
Cantidad disponible: 15 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 248,35
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 126,26
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: new. Questo è un articolo print on demand.
Idioma: Inglés
Publicado por Springer Netherlands Dez 2010, 2010
ISBN 10: 904815085X ISBN 13: 9789048150854
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 160,49
Cantidad disponible: 2 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. 308 pp. Englisch.
Librería: moluna, Greven, Alemania
EUR 136,16
Cantidad disponible: Más de 20 disponibles
Añadir al carritoGebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within.
Librería: moluna, Greven, Alemania
EUR 136,16
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within.
Librería: preigu, Osnabrück, Alemania
EUR 141,20
Cantidad disponible: 5 disponibles
Añadir al carritoBuch. Condición: Neu. Electronic Packaging for High Reliability, Low Cost Electronics | R. R. Tummala (u. a.) | Buch | x | Englisch | 2000 | Springer Netherland | EAN 9780792352181 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 220,59
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. Print on Demand pp. 328.
Idioma: Inglés
Publicado por Springer Netherlands, Springer Netherlands Feb 2000, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 160,49
Cantidad disponible: 1 disponibles
Añadir al carritoBuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 312 pp. Englisch.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 221,23
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. Print on Demand pp. 312 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Idioma: Inglés
Publicado por Springer Netherlands, Springer Dez 2010, 2010
ISBN 10: 904815085X ISBN 13: 9789048150854
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 160,49
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 308 pp. Englisch.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 220,93
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. PRINT ON DEMAND pp. 328.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 221,47
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. PRINT ON DEMAND pp. 312.
Idioma: Inglés
Publicado por Springer Netherlands Feb 2000, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 208,64
Cantidad disponible: 2 disponibles
Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. 312 pp. Englisch.