Interconnect reliability advanced memory de gan chong (18 resultados)

Condición: New. In.

Condición: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Hardcover. Condición: new. Hardcover. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Taschenbuch. Condición: Neu. Interconnect Reliability in Advanced Memory Device Packaging | Chong Leong Gan (u. a.) | Taschenbuch | Springer Series in Reliability Engineering | xviii | Englisch | 2024 | Springer | EAN 9783031267109 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Condición: New. 2023rd edition NO-PA16APR2015-KAP.

Condición: New. 2023rd edition NO-PA16APR2015-KAP.

Hardcover. Condición: Brand New. 228 pages. 9.25x6.10x0.63 inches. In Stock.

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.…

PAP. Condición: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

PAP. Condición: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Condición: new. Questo è un articolo print on demand.

Condición: new. Questo è un articolo print on demand.

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the rel.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the rel.…

Condición: New. Print on Demand.

Condición: New. Print on Demand.

Condición: New. PRINT ON DEMAND.

Condición: New. PRINT ON DEMAND.