Interconnect Reliability in Advanced Memory Device Packaging (Springer Series in Reliability Engineering) - Tapa dura
Libro 86 de 90: Springer Series in Reliability Engineering
Sinopsis
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.
In the past 40 years, memory packaging processes have evolved enormously.
"Sinopsis" puede pertenecer a otra edición de este libro.
De la contraportada
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.
In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.
This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
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Interconnect Reliability in Advanced Memory Device Packaging (eng)
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Interconnect Reliability in Advanced Memory Device Packaging
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Springer, Berlin|Springer International Publishing|Springer, 2023
ISBN 10: 3031267079
ISBN 13: 9783031267079
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the rel. Nº de ref. del artículo: 799921343
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Interconnect Reliability in Advanced Memory Device Packaging
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Springer International Publishing Apr 2023, 2023
ISBN 10: 3031267079
ISBN 13: 9783031267079
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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. 228 pp. Englisch. Nº de ref. del artículo: 9783031267079
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Interconnect Reliability in Advanced Memory Device Packaging
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Interconnect Reliability in Advanced Memory Device Packaging (Hardcover)
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Springer International Publishing AG, Cham, 2023
ISBN 10: 3031267079
ISBN 13: 9783031267079
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Hardcover. Condición: new. Hardcover. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Nº de ref. del artículo: 9783031267079
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Interconnect Reliability in Advanced Memory Device Packaging
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Interconnect Reliability in Advanced Memory Device Packaging
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Springer International Publishing, Springer Nature Switzerland Apr 2023, 2023
ISBN 10: 3031267079
ISBN 13: 9783031267079
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
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Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 228 pp. Englisch. Nº de ref. del artículo: 9783031267079
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Interconnect Reliability in Advanced Memory Device Packaging
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Springer International Publishing, 2023
ISBN 10: 3031267079
ISBN 13: 9783031267079
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Librería: AHA-BUCH GmbH, Einbeck, Alemania
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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. Nº de ref. del artículo: 9783031267079
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Interconnect Reliability in Advanced Memory Device Packaging (Springer Series in Reliability Engineering)
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Interconnect Reliability in Advanced Memory Device Packaging (Springer Series in Reliability Engineering)
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