EUR 37,90
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Añadir al carritoCondición: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
Librería: Solr Books, Lincolnwood, IL, Estados Unidos de America
EUR 18,46
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Añadir al carritoCondición: very_good. This books is in Very good condition. There may be a few flaws like shelf wear and some light wear.
Librería: Patrico Books, Apollo Beach, FL, Estados Unidos de America
EUR 14,95
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Añadir al carritohardcover. Condición: As New. 2nd. Ships Out Tomorrow!
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 158,45
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Librería: Best Price, Torrance, CA, Estados Unidos de America
EUR 192,02
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Librería: Best Price, Torrance, CA, Estados Unidos de America
EUR 192,02
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Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 203,66
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Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 204,04
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Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 225,90
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Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 220,91
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Añadir al carritoHardcover. Condición: Like New. Like New. book.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 239,72
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Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 240,13
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Añadir al carritoCondición: As New. Unread book in perfect condition.
Publicado por Springer-Verlag New York Inc., 2007
ISBN 10: 0387465464 ISBN 13: 9780387465463
Idioma: Inglés
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 250,72
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Añadir al carritoCondición: New. Presents the work on defect-oriented testing. This book is useful for test and design practitioners from academia and industry. Series: Frontiers in Electronic Testing. Num Pages: 349 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 20. Weight in Grams: 669. . 2007. 2nd ed. 2007. Hardback. . . . .
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
EUR 202,48
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Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
EUR 202,88
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Publicado por Springer-Verlag New York Inc., New York, NY, 2007
ISBN 10: 0387465464 ISBN 13: 9780387465463
Idioma: Inglés
Librería: Grand Eagle Retail, Mason, OH, Estados Unidos de America
EUR 206,37
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Añadir al carritoHardcover. Condición: new. Hardcover. Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 280,52
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Añadir al carritoCondición: New. pp. 352 2nd Edition.
Publicado por Springer-Verlag New York Inc., 2010
ISBN 10: 1441942858 ISBN 13: 9781441942852
Idioma: Inglés
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 283,49
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Añadir al carritoCondición: New. Series: Frontiers in Electronic Testing. Num Pages: 349 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 18. Weight in Grams: 539. . 2010. Softcover reprint of hardcover 2nd ed. 2007. paperback. . . . .
Publicado por Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441942858 ISBN 13: 9781441942852
Idioma: Inglés
Librería: Grand Eagle Retail, Mason, OH, Estados Unidos de America
EUR 229,97
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Añadir al carritoPaperback. Condición: new. Paperback. Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 297,41
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Añadir al carritoPaperback. Condición: Brand New. 2nd edition. 349 pages. 9.10x6.10x0.90 inches. In Stock.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 300,00
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Añadir al carritoHardcover. Condición: Brand New. 2nd edition. 328 pages. 9.25x6.25x0.75 inches. In Stock.
Publicado por Springer-Verlag New York Inc., 2007
ISBN 10: 0387465464 ISBN 13: 9780387465463
Idioma: Inglés
Librería: Kennys Bookstore, Olney, MD, Estados Unidos de America
EUR 314,20
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Añadir al carritoCondición: New. Presents the work on defect-oriented testing. This book is useful for test and design practitioners from academia and industry. Series: Frontiers in Electronic Testing. Num Pages: 349 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 20. Weight in Grams: 669. . 2007. 2nd ed. 2007. Hardback. . . . . Books ship from the US and Ireland.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 307,14
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Añadir al carritoPaperback. Condición: Like New. Like New. book.
Publicado por Springer-Verlag New York Inc., 2010
ISBN 10: 1441942858 ISBN 13: 9781441942852
Idioma: Inglés
Librería: Kennys Bookstore, Olney, MD, Estados Unidos de America
EUR 354,82
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Añadir al carritoCondición: New. Series: Frontiers in Electronic Testing. Num Pages: 349 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 18. Weight in Grams: 539. . 2010. Softcover reprint of hardcover 2nd ed. 2007. paperback. . . . . Books ship from the US and Ireland.
Publicado por Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441942858 ISBN 13: 9781441942852
Idioma: Inglés
Librería: AussieBookSeller, Truganina, VIC, Australia
EUR 357,92
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Añadir al carritoPaperback. Condición: new. Paperback. Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Publicado por Springer-Verlag New York Inc., New York, NY, 2007
ISBN 10: 0387465464 ISBN 13: 9780387465463
Idioma: Inglés
Librería: AussieBookSeller, Truganina, VIC, Australia
EUR 361,37
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Añadir al carritoHardcover. Condición: new. Hardcover. Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Librería: moluna, Greven, Alemania
EUR 180,07
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Wide coverage of topics in test engineeringUnique defect-oriented focus of the materialsIntroduction to yield engineering common practicesThe 2nd edition of defect oriented testing has been extensively updated. New cha.
Librería: moluna, Greven, Alemania
EUR 180,07
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Wide coverage of topics in test engineeringUnique defect-oriented focus of the materialsIntroduction to yield engineering common practicesThe 2nd edition of defect oriented testing has been extensively updated. New cha.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 296,88
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Añadir al carritoCondición: New. Print on Demand pp. 352 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 301,89
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Añadir al carritoCondición: New. PRINT ON DEMAND pp. 352.