Isbn: 9780471591672 - soldering processes and equipment (20 resultados)

HRD. Condición: New. New Book. Shipped from UK. Established seller since 2000.

Condición: New.

Condición: new.

Condición: As New. Unread book in perfect condition.

Condición: New.

Condición: New. In English.

Condición: As New. Unread book in perfect condition.

Condición: New.

Hardback. Condición: New. New copy - Usually dispatched within 4 working days.

Condición: New. pp. 312.

Condición: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Editor(s): Pecht, Michael. Num Pages: 312 pages, Ill. BIC Classification: TGP; TGX; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 242 x 159 x 20. Weight in Grams: 539. . 1993. Hardback. . . . .…

Condición: New. pp. 312 1st Edition.

Condición: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics.

Hardcover. Condición: Brand New. 1st edition. 312 pages. 9.75x6.50x0.75 inches. In Stock.

Condición: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Editor(s): Pecht, Michael. Num Pages: 312 pages, Ill. BIC Classification: TGP; TGX; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 242 x 159 x 20. Weight in Grams: 539. . 1993. Hardback. . . . . Books ship from the US and Ireland.…

Buch. Condición: Neu. Neuware - Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.…

Hardcover. Condición: new. Hardcover. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Hardcover. Condición: Brand New. 1st edition. 312 pages. 9.75x6.50x0.75 inches. In Stock. This item is printed on demand.

Hardback. Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 569.

Condición: New. PRINT ON DEMAND pp. 312.