Raik jaan (48 resultados)

Condición: New. pp. 233.

Condición: New. pp. 240.

Paperback. Condición: Brand New. rep rev edition. 248 pages. 9.25x6.10x0.56 inches. In Stock.

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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design.…

Taschenbuch. Condición: Neu. VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability | 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers | Thomas Hollstein (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | xiv | Englisch | 2018 | Springer | EAN 9783319883793 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Condición: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Condición: New.

Condición: New.

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Condición: New. 1st ed. 2024 edition NO-PA16APR2015-KAP.

Condición: New. In English.

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Condición: New.

Hardback. Condición: New. Illustrated.

Hardcover. Condición: Brand New. 608 pages. 9.25x6.10x1.26 inches. In Stock.

Condición: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.…

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This is the first book that sums up test-related modeling of digital circuits and systems by a new structural-decision-diagrams model. The model represents structural and functional information jointly and opens a new area of research.The book introduces and discusses applications of two types of structural decision diagrams (DDs): low-level,structurally synthesized binary DDs (SSBDDs)andhigh-level DDs (HLDDs)that enable diagnostic modeling of complex digital circuits and systems.Topics and features:Provides the definition, properties and techniques for synthesis, compression and optimization of SSBDDs and HLDDsProvides numerous working examples that illustrate the key points of the textDescribes applications of SSBDDs and HLDDs for various electronic design automation (EDA) tasks, such as logic-level fault modeling and simulation, multi-valued simulation, timing-critical path identification, and test generationDiscusses the advantages of the proposed model to traditional binary decision diagrams and other traditional design representationsCombines SSBDDs with HLDDs for multi-level representation of digital systems for enabling hierarchical and cross-level solving of complex test-related tasksThis unique book is aimed at researchers working in the fields of computerscience and computer engineering, focusing on test, diagnosis and dependability of digital systems. It can also serve as a reference for graduate- and advanced undergraduate-level computer engineering and electronics courses.Three authors are affiliated with the Dept. of Computer Systems at the Tallinn University of Technology, Estonia:Raimund Ubaris a retired Professor,Jaan RaikandMaksim Jenihhinare tenured Professors.Artur Jutman, PhD, is a researcher at the same university and the CEO of Testonica Lab Ltd., Estonia.…

Hardback. Condición: New. Illustrated.

Condición: New.

Hardcover. Condición: Brand New. 608 pages. 9.25x6.10x1.26 inches. In Stock.

Condición: As New. Unread book in perfect condition.

Condición: As New. Unread book in perfect condition.

Condición: new. Questo è un articolo print on demand.

Condición: new. Questo è un articolo print on demand.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. 248 pp. Englisch. …

Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. 248 pp. Englisch.…

Condición: New. Print on Demand pp. 233.

Condición: New. PRINT ON DEMAND pp. 233.