Advanced interconnects ulsi technology (15 resultados)
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Librería: Basi6 International, Irving, TX, Estados Unidos de AmericaBasi6 International
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EUR 147,12
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Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
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Librería: GreatBookPrices, Columbia, MD, Estados Unidos de AmericaGreatBookPrices
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EUR 172,63
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Condición: New.
Advanced Interconnects for ULSI Technology Format: Hardcover
Mikhail Baklanov (IMEC); Paul S. Ho (University of Texas at Austin); Ehrenfried Zschech (Fraunhofer Inst. for Non-Destr. Testing)
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Librería: INDOO, Avenel, NJ, Estados Unidos de AmericaINDOO
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EUR 175,00
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Condición: New. Brand New.
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- Primera edición
Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de AmericaGrand Eagle Retail
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EUR 232,17
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Hardcover. Condición: new. Hardcover. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a singl…e chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirementsLow-k materials: fundamentals, advances and mechanical propertiesConductive layers and barriersIntegration and reliability including mechanical reliability, electromigration and electrical breakdownNew approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
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Librería: GreatBookPricesUK, Woodford Green, Reino UnidoGreatBookPricesUK
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EUR 233,83
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Condición: New.
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Librería: Ubiquity Trade, Miami, FL, Estados Unidos de AmericaUbiquity Trade
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EUR 251,81
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Condición: New. Brand new! Please provide a physical shipping address.
Advanced Interconnects for ULSI Technology
. Ed(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
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Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 252,27
Envío por EUR 9,50Se envía de Irlanda a Estados Unidos de AmericaCantidad disponible: 15 disponibles
Condición: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.;… Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . .
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Librería: moluna, Greven, Alemaniamoluna
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EUR 233,70
Envío por EUR 48,99Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.
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- Primera edición
Librería: CitiRetail, Stevenage, Reino UnidoCitiRetail
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EUR 254,78
Envío por EUR 43,28Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: new. Hardcover. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a singl…e chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirementsLow-k materials: fundamentals, advances and mechanical propertiesConductive layers and barriersIntegration and reliability including mechanical reliability, electromigration and electrical breakdownNew approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Advanced Interconnects for ULSI Technology
. Ed(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
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Librería: Kennys Bookstore, Olney, MD, Estados Unidos de AmericaKennys Bookstore
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 314,63
Envío por EUR 9,10Se envía dentro de Estados Unidos de AmericaCantidad disponible: 15 disponibles
Condición: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.;… Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . Books ship from the US and Ireland.
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- Edición internacional
Librería: UK BOOKS STORE, London, LONDO, Reino UnidoUK BOOKS STORE
Contactar con el vendedorVendedor de 4 estrellasEdición internacionalCondición: Usado
EUR 327,93
Gastos de envío gratisSe envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 3 disponibles
Condición: New Books. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested… if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
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Librería: GreatBookPricesUK, Woodford Green, Reino UnidoGreatBookPricesUK
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Como Nuevo
EUR 371,03
Envío por EUR 17,54Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: As New. Unread book in perfect condition.
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Librería: Mispah books, Redhill, SURRE, Reino UnidoMispah books
Contactar con el vendedorVendedor de 4 estrellasCondición: Usado - Como Nuevo
EUR 361,41
Envío por EUR 29,24Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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- Primera edición
Librería: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
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EUR 367,08
Envío por EUR 32,08Se envía de Australia a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: new. Hardcover. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a singl…e chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirementsLow-k materials: fundamentals, advances and mechanical propertiesConductive layers and barriersIntegration and reliability including mechanical reliability, electromigration and electrical breakdownNew approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Tapa dura
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de AmericaGreatBookPrices
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Como Nuevo
EUR 400,23
Envío por EUR 2,29Se envía dentro de Estados Unidos de AmericaCantidad disponible: 3 disponibles
Condición: As New. Unread book in perfect condition.
