9781259861550 - fundamentals of device and systems packaging: technologies and applications, second edition (electronics) de tummala, rao (22 resultados)
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Hardcover. Condición: Fine. Abnutzung / Risse - leicht. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. A fully updated, comprehensive guide to electronic packaging technologies This thorou…ghly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. - Covers the electrical, mechanical, chemical, and materials aspects of each technology - Contains examples of all common configurations and technologies - Written by the leading author in the field.
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Hardback. Condición: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practicesThis t…horoughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore's Law for packaging, as Moore's Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore's Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore's Law for ICs. This book lays the groundwork for Moore's Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with.
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Hardback. Condición: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practicesThis t…horoughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore's Law for packaging, as Moore's Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore's Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore's Law for ICs. This book lays the groundwork for Moore's Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with.
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Hardback. Condición: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practicesThis t…horoughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore's Law for packaging, as Moore's Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore's Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore's Law for ICs. This book lays the groundwork for Moore's Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with.
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Hardback. Condición: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practicesThis t…horoughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore's Law for packaging, as Moore's Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore's Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore's Law for ICs. This book lays the groundwork for Moore's Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with.
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Hardcover. Condición: gut. 2019. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition In englischer Sprache. pages.
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Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Über den AutorRao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II,…and III, the best-selling .
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Hardcover. Condición: new. Hardcover. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A fully updated, comprehensive guide to microelectronic device and systems packaging principles and prac…ticesThis thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moores Law for packaging, as Moores Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moores Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moores Law for ICs. This book lays the groundwork for Moores Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Buch. Condición: Neu. Fundamentals of Device and Systems Packaging | Technologies and Applications, Second Edition | Rao Tummala | Buch | Gebunden | Englisch | 2019 | McGraw Hill | EAN 9781259861550 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print o…n Demand.
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Buch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A fully updated, comprehensive guide to microelectronic…device and systems packaging principles and practicesThis thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems.Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore's Law for packaging, as Moore's Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore's Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore's Law for ICs. This book lays the groundwork for Moore's Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with.
