Idioma: Inglés
Publicado por John Wiley & Sons Inc--Halsted Press, 1972
ISBN 10: 0470138521 ISBN 13: 9780470138526
Librería: Small World Books, Rochester, NY, Estados Unidos de America
Original o primera edición
EUR 16,10
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Very Good. Estado de la sobrecubierta: Very Good. 1st American Edition. Dark covers with white lettering on spine. Former owner's name on front cover and thin brown line going down front endpaper probably caused by dust jacket's edge. Silver dust jacket with black lettering.
EUR 16,68
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,450grams, ISBN:0333138317.
EUR 28,26
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Very Good. Estado de la sobrecubierta: Very Good. hardback book and dust jacket in very good condition.
EUR 11,83
Cantidad disponible: 1 disponibles
Añadir al carritoSoft cover. Condición: Very Good. 2nd Edition. No inscriptions and very little use. A clean, tight copy of xvi. 492pp.
Idioma: Inglés
Publicado por John Wiley & Sons, New York, 1986
ISBN 10: 0470206942 ISBN 13: 9780470206942
Librería: Take Five Books, Ashland, OR, Estados Unidos de America
EUR 33,12
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Very Good. Estado de la sobrecubierta: Very Good. Second Edition. Expedited or International shipping may cost more.
Librería: ThriftBooks-Dallas, Dallas, TX, Estados Unidos de America
EUR 38,80
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Good. No Jacket. Former library book; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
Idioma: Inglés
Publicado por Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: California Books, Miami, FL, Estados Unidos de America
EUR 41,51
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
EUR 27,78
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,550grams, ISBN:9780333694657.
EUR 29,49
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. In fair condition, suitable as a study copy. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,800grams, ISBN:9780333405871.
EUR 29,55
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In poor condition, suitable as a reading copy. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,550grams, ISBN:9780333694657.
Idioma: Inglés
Publicado por Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 36,31
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.
EUR 42,40
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.
EUR 42,40
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned.
Idioma: Inglés
Publicado por Cambridge University Press 2014-05, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: Chiron Media, Wallingford, Reino Unido
EUR 34,34
Cantidad disponible: 10 disponibles
Añadir al carritoPF. Condición: New.
Idioma: Inglés
Publicado por Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 45,34
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Idioma: Inglés
Publicado por Cambridge University Press CUP, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 58,09
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. pp. 422.
Idioma: Inglés
Publicado por Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: Kennys Bookstore, Olney, MD, Estados Unidos de America
EUR 55,69
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Publicado por Macmillan, 1972
Librería: Librodifaccia, Alessandria, AL, Italia
EUR 9,00
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Buone. inglese Condizioni dell'esterno: Discrete con difetti, strappi Condizioni dell'interno: Buone.
Idioma: Inglés
Publicado por Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 56,40
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Idioma: Inglés
Publicado por Cambridge University Press, Cambridge, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de America
EUR 41,50
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Idioma: Inglés
Publicado por Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: Revaluation Books, Exeter, Reino Unido
EUR 36,64
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: Brand New. 1st edition. 422 pages. 8.90x6.00x1.00 inches. In Stock. This item is printed on demand.
Idioma: Inglés
Publicado por Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: THE SAINT BOOKSTORE, Southport, Reino Unido
EUR 40,84
Cantidad disponible: Más de 20 disponibles
Añadir al carritoPaperback / softback. Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Idioma: Inglés
Publicado por Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: Majestic Books, Hounslow, Reino Unido
EUR 55,89
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. Print on Demand pp. 422.
Idioma: Inglés
Publicado por Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 55,60
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. PRINT ON DEMAND pp. 422.
Idioma: Inglés
Publicado por Cambridge University Press, Cambridge, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: CitiRetail, Stevenage, Reino Unido
EUR 42,56
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Idioma: Inglés
Publicado por Cambridge University Press, 2012
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: moluna, Greven, Alemania
EUR 42,05
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.KlappentextThe MRS Symposium Proceeding series is an internationally recognised reference suitable for research.
Idioma: Inglés
Publicado por Cambridge University Press, Cambridge, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Librería: AussieBookSeller, Truganina, VIC, Australia
EUR 65,10
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.