Packaging introduction (101 resultados)

Condición: Good. [ No Hassle 30 Day Returns ][ Ships Daily ] [ Underlining/Highlighting: NONE ] [ Writing: NONE ] [ Edition: Reprint ] Publisher: Van Nostrand Reinhold Pub Date: 1/1/1990 Binding: Paperback Pages: 215 Reprint edition.

paperback. Condición: as new. 7 1/2 x 9 1/8" 212 pages.

Condición: Good. Good condition. Good dust jacket. A copy that has been read but remains intact. May contain markings such as bookplates, stamps, limited notes and highlighting, or a few light stains.

Condición: good. Fast & Free Shipping â" Good condition. It may show normal signs of use, such as light writing, highlighting, or library markings, but all pages are intact and the book is fully readable. A solid, complete copy that's ready to enjoy.

Paperback. Condición: Brand New. 150 pages. 11.00x8.50x0.38 inches. In Stock.

Soft cover. Condición: Near Fine.

Condición: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…

Condición: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Book contains pencil markings. In poor condition, suitable as a reading copy. No dust jacket. Re-bound by library. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,900grams, ISBN:0136478425.…

hardcover. Condición: Very Good.

Hardcover. Condición: new. Hardcover. This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions. This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Hardcover. Condición: New. Edition Unstated. Still in Shrinkwrap Quantity Available: 1. Category: Medicine & Health; ISBN: 0072834021. ISBN/EAN: 9780072834024. Pictures of this item not already displayed here available upon request. Inventory No: 1560732186.

Condición: New.

Hardback or Cased Book. Condición: New. Introduction to Microelectronics Advanced Packaging Assurance. Book.

Condición: New.

Condición: As New. Unread book in perfect condition.

Encuadernación de tapa blanda. Condición: Perfecto. Van Nostrand Reinhold Company, USA, 1990. Texto en inglés. Arte. Diseño. Profusamente ilustrado. 212 pp. 23 x 19. Tapa blanda de editorial ilustrada. Sin subrayados ni anotaciones. PEGATINA EN BLANCO DE SIGNATURA EN PARTE INFERIOR LOMO, por lo demás: Perfecto estado de conservación. ISBN: 9780442318635.…

paperback. Condición: New. Language:Chinese.Paperback. Publisher: Science out.

paperback. Condición: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Publisher: Chemical Industry Press. This book describes the concept and basic functions of packaging. packaging materials and packaging containersFour Satisfaction guaranteed,or money back.…

paperback. Condición: New. Paperback. Pub Date: 2011 08 Pages: 215 Publisher: Printing Industry Press Regular Higher Education Eleventh Five-Year national planning materials: the Packaging Introduction (2nd edition) the second edition of the amendments are still given the highest priority needs of learners according to the first version of the application and highlight the packaging industry management. updated involved in the first version of the data. information and knowledge. and reasonable adjustments to the struc.…

Condición: New. In English.

Condición: New.

Condición: As New. Unread book in perfect condition.

Condición: New.

Condición: As New. Unread book in perfect condition.

paperback. Condición: New. Language:Chinese.Pages Number: 48 Publisher: Guangxi Fine Arts Pub. Date :1996-08-01 version 1 2001-10-01.

paperback. Condición: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Introduction to Packaging Machinery (Printing Press)Four Satisfaction guaranteed,or money back.

Condición: New.

Hardcover. Condición: Brand New. 200 pages. 9.44x6.61x9.61 inches. In Stock.

Condición: New. pp. 232.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions. …