Learning approaches signal processing (31 resultados)

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hardcover. Condición: Very Good. Complete and clean. All pages present and readable, binding intact. Highlighting or writing is absent or limited to a handful of pages. No water damage. Cover and spine may show light shelf wear, edge bumping, or minor creasing. May have a remainder mark, stickers or sticker residue, or a previous owner's name. Access codes, CDs, DVDs, and other bundled supplements may not be included and should be assumed used or missing unless the listing explicitly states otherwise.…

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paperback. Condición: New. Special order direct from the distributor.

Paperback. Condición: Brand New. pap/dsk edition. 210 pages. 11.00x8.75x0.50 inches. In Stock.

Taschenbuch. Condición: Neu. Intelligent diagnosis of rotating machines using VMD | Advanced approaches to signal processing and machine learning | Ammar Mrabti (u. a.) | Taschenbuch | Englisch | 2026 | Our Knowledge Publishing | EAN 9786209500664 | Verantwortliche Person für die EU: SIA OmniScriptum Publishing, Brivibas Gatve 197, 1039 RIGA, LETTLAND, customerservice[at]vdm-vsg[dot]de | Anbieter: preigu.…

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Taschenbuch. Condición: Neu. 3D Imaging Technologies-Multi-dimensional Signal Processing and Deep Learning | Mathematical Approaches and Applications, Volume 1 | Lakhmi C. Jain (u. a.) | Taschenbuch | xii | Englisch | 2022 | Springer | EAN 9789811633935 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

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Hardcover. Condición: Brand New. 587 pages. 9.75x6.75x1.50 inches. In Stock.

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents high-quality research in the field of 3D imaging technology. The second edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL)continues the good traditions already established by the first 3DIT conference (IC3DIT2019) to provide a wide scientific forum for researchers, academia and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in 2 volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.…

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents high-quality research in the field of 3D imaging technology. The second edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL)continues the good traditions already established by the first 3DIT conference (IC3DIT2019) to provide a wide scientific forum for researchers, academia and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in 2 volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.…

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Paperback. Condición: Brand New. 362 pages. 9.25x6.10x0.91 inches. In Stock.

Hardcover. Condición: Brand New. 360 pages. 9.25x6.10x9.21 inches. In Stock.

Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book presents an innovative approach to fault diagnosis in rotating machines, based on Variational Mode Decomposition (VMD) and artificial intelligence techniques. It begins with an analysis of condition monitoring strategies and the limitations of conventional signal processing methods. VMD is compared with Empirical Mode Decomposition (EMD) to demonstrate its superiority for extracting fault signatures in noisy environments. A criterion based on Shannon entropy is proposed to optimize the number of modes, while the integration of Multiresolution Wavelet Decomposition (WMRA) improves detection of weak defects. Finally, a hybrid VMD-LSTM model is developed for automatic classification and assessment of fault severity. Combining scientific rigor and experimental validation, this book offers a major contribution to predictive diagnostics and intelligent maintenance in the context of Industry 4.0.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Wan-Chi Siu, a PhD graduate of Imperial College London, is emeritus professor and was chair professor, head (Electronic and Information Engineering), and dean of the Engineering Faculty of the Hong Kong Polytechnic University. He was the.…

Hardcover. Condición: Brand New. 587 pages. 9.75x6.75x1.50 inches. In Stock. This item is printed on demand.