Failure analysis integrated circuits (32 resultados)

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hardcover. Condición: New. In shrink wrap. Looks like an interesting title.

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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.…

Taschenbuch. Condición: Neu. Failure Analysis of Integrated Circuits | Tools and Techniques | Lawrence C. Wagner | Taschenbuch | The Springer International Series in Engineering and Computer Science | xiii | Englisch | 2012 | Springer | EAN 9781461372318 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Condición: New. Provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. This book also includes the coverage of the shortcomings, limitations, and strengths of each technique. Editor(s): Wagner, Lawrence C. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 255 pages, biography. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 17. Weight in Grams: 565. . 1999. 1999th Edition. hardcover. . . . .…

Condición: gut. 1999. Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494, Band 494) In englischer Sprache. pages.

Condición: New. pp. 272.

Condición: New. pp. 276.

Condición: New. Provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. This book also includes the coverage of the shortcomings, limitations, and strengths of each technique. Editor(s): Wagner, Lawrence C. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 255 pages, biography. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 17. Weight in Grams: 565. . 1999. 1999th Edition. hardcover. . . . . Books ship from the US and Ireland.…

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Paperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

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Paperback. Condición: Good. Dust Jacket NOT present. CD WILL BE MISSING. . SHIPS FROM MULTIPLE LOCATIONS. book.

Condición: new. Questo è un articolo print on demand.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This 'must have' reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. 272 pp. Englisch.…

Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This 'must have' reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. 276 pp. Englisch.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This must have reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical fa.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This must have reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical fa.…

Buch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.…

Buch. Condición: Neu. Failure Analysis of Integrated Circuits | Tools and Techniques | Lawrence C. Wagner | Buch | The Springer International Series in Engineering and Computer Science | xiii | Englisch | 1999 | Springer | EAN 9780412145612 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. …

Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 276 pp. Englisch.…

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 272 pp. Englisch.…

Condición: New. Print on Demand pp. 272 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

Condición: New. Print on Demand pp. 276 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.