Idioma: Inglés
Publicado por Springer Nature Singapore, 2022
ISBN 10: 9811931313 ISBN 13: 9789811931314
Librería: Buchpark, Trebbin, Alemania
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Añadir al carritoCondición: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher | This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
Idioma: Inglés
Publicado por Springer Verlag, Singapore, Singapore, 2022
ISBN 10: 9811931313 ISBN 13: 9789811931314
Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de America
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Añadir al carritoHardcover. Condición: new. Hardcover. This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Añadir al carritoCondición: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.
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Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
Librería: Revaluation Books, Exeter, Reino Unido
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Añadir al carritoHardcover. Condición: Brand New. 188 pages. 9.25x6.10x0.63 inches. In Stock.
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Añadir al carritoCondición: new. Questo è un articolo print on demand.
Idioma: Inglés
Publicado por Springer Nature Singapore Jul 2022, 2022
ISBN 10: 9811931313 ISBN 13: 9789811931314
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 160,49
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Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 188 pp. Englisch.
Idioma: Inglés
Publicado por Springer, Berlin|Springer Nature Singapore|Springer, 2022
ISBN 10: 9811931313 ISBN 13: 9789811931314
Librería: moluna, Greven, Alemania
EUR 136,16
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Añadir al carritoGebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimenta.
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Añadir al carritoBuch. Condición: Neu. Thermal Reliability of Power Semiconductor Device in the Renewable Energy System | Xiong Du (u. a.) | Buch | xvi | Englisch | 2022 | Springer | EAN 9789811931314 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
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Añadir al carritoCondición: New. Print on Demand.
Idioma: Inglés
Publicado por Springer, Springer Jul 2022, 2022
ISBN 10: 9811931313 ISBN 13: 9789811931314
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 160,49
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Añadir al carritoBuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
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