9789811539220 - assembly and reliability of lead-free solder joints de lee, ning-cheng; lau, john h. (11 resultados)
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Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de AmericaGrand Eagle Retail
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EUR 149,69
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Paperback. Condición: new. Paperback. This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional an…d advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Librería: Books Puddle, New York, NY, Estados Unidos de AmericaBooks Puddle
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EUR 173,47
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Condición: New. 1st ed. 2020 edition NO-PA16APR2015-KAP.
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Librería: preigu, Osnabrück, Alemaniapreigu
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EUR 108,65
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Taschenbuch. Condición: Neu. Assembly and Reliability of Lead-Free Solder Joints | John H. Lau (u. a.) | Taschenbuch | xxi | Englisch | 2021 | Springer | EAN 9789811539220 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Idioma: Inglés
Editorial: Springer Nature Singapore, Springer Nature Singapore, 2021
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 127,42
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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major top…ics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
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Librería: Revaluation Books, Exeter, Reino UnidoRevaluation Books
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EUR 188,51
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Paperback. Condición: Brand New. 548 pages. 9.25x6.10x0.94 inches. In Stock.
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Librería: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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EUR 98,25
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Condición: new. Questo è un articolo print on demand.
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 123,04
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a num…ber of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. 552 pp. Englisch.
Idioma: Inglés
Editorial: Springer, Berlin|Springer Nature Singapore|Springer, 2021
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Librería: moluna, Greven, Alemaniamoluna
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EUR 102,81
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth s…tudies on a number of major topics su.
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Librería: Majestic Books, Hounslow, Reino UnidoMajestic Books
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EUR 181,13
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Condición: New. Print on Demand.
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
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EUR 123,04
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number…of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 552 pp. Englisch.
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Librería: Biblios, frankfurt am main, HESSE, AlemaniaBiblios
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EUR 181,10
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Condición: New. PRINT ON DEMAND.
