9780470827833 - led packaging for lighting applications: design, manufacturing, and testing de liu, shen; luo, xiaobing (22 resultados)

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Librería: BooksRun, Philadelphia, PA, Estados Unidos de AmericaBooksRun
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Hardcover. Condición: Very Good. 1. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

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HRD. Condición: New. New Book. Shipped from UK. Established seller since 2000.

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Condición: New. In English.

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Librería: Majestic Books, Hounslow, Reino UnidoMajestic Books
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Condición: New. pp. xx + 352 Illus.

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Hardcover. Condición: New.

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Condición: New. Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. Num Pages: 376 pages, Illustratio…ns. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 250 x 174 x 25. Weight in Grams: 790. . 2011. 1st Edition. Hardcover. . . . .

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Librería: Books Puddle, New York, NY, Estados Unidos de AmericaBooks Puddle
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Condición: New. pp. xx + 352 Index.

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Librería: California Books, Miami, FL, Estados Unidos de AmericaCalifornia Books
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Librería: Kennys Bookstore, Olney, MD, Estados Unidos de AmericaKennys Bookstore
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EUR 191,52
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Condición: New. Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. Num Pages: 376 pages, Illustratio…ns. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 250 x 174 x 25. Weight in Grams: 790. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.

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Librería: GreatBookPricesUK, Woodford Green, Reino UnidoGreatBookPricesUK
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EUR 214,49
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Condición: As New. Unread book in perfect condition.

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Librería: Mispah books, Redhill, SURRE, Reino UnidoMispah books
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Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

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Librería: Revaluation Books, Exeter, Reino UnidoRevaluation Books
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EUR 224,05
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Hardcover. Condición: Brand New. 1st edition. 320 pages. 8.66x6.08x0.89 inches. In Stock.

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Librería: GreatBookPrices, Columbia, MD, Estados Unidos de AmericaGreatBookPrices
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Condición: As New. Unread book in perfect condition.

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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 235,80
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Buch. Condición: Neu. Neuware.

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Librería: Biblios, frankfurt am main, HESSE, AlemaniaBiblios
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Condición: New.

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Librería: Revaluation Books, Exeter, Reino UnidoRevaluation Books
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Hardcover. Condición: Brand New. 1st edition. 320 pages. 8.66x6.08x0.89 inches. In Stock. This item is printed on demand.

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Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de AmericaGrand Eagle Retail
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EUR 178,57
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Hardcover. Condición: new. Hardcover. Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have s…uperior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testingFocuses on the design of LED packaging and its applications such as road lightsIncludes design methods and experiences necessary for LED engineers, especially optical and thermal designIntroduces novel LED packaging structures and manufacturing processes, such as ASLPCovers reliability considerations, the most challenging problem for the LED industryProvides measurement and testing standards, which are critical for LED development, for both LED and LED fixturesCodes and demonstrations available from the books Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

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Librería: CitiRetail, Stevenage, Reino UnidoCitiRetail
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EUR 196,51
Envío por EUR 43,05Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: new. Hardcover. Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have s…uperior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testingFocuses on the design of LED packaging and its applications such as road lightsIncludes design methods and experiences necessary for LED engineers, especially optical and thermal designIntroduces novel LED packaging structures and manufacturing processes, such as ASLPCovers reliability considerations, the most challenging problem for the LED industryProvides measurement and testing standards, which are critical for LED development, for both LED and LED fixturesCodes and demonstrations available from the books Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.