Isbn: 9780412085611 - microelectronics packaging handbook. cd-rom, second edition (8 resultados)

Condición: New. pp. 1000 2nd Edition.

Condición: New. pp. 1000.

Condición: New. pp. 1000.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.…

Compact Disc. Condición: new. Compact Disc. Providing recent advances in microelectronics design methods, modelling tools, simulation techniques and manufacturing processes, this work discusses packages that meet the power, cooling, protection and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information. The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

CD-ROM. Condición: Brand New. 2nd edition. 1000 pages. 7.00x7.25x1.00 inches. In Stock.