T�tulo: Microelectronics Packaging Handbook, Vol.s 1-3: CD-ROM, Second Edition
Editor: Springer
Fecha de publicaci�n: 1998
Idioma: Ingl�s
ISBN 10: 0412085615
ISBN 13: 9780412085611
Encuadernaci�n: CD-ROM
Edici�n: 2� Edici�n
Estado: Brand New

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Sinopsis

The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.

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Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

Rymaszewski is Research Professor in Materials Science & Engineering and Associate Director of the Center for Integrated Electronics at Rensselaer Polytechnic Institute.

Klopfenstein is President of AGK Enterprises in Hopewell Junction, New York.

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Informaci�n empresarial del vendedor

Edward Bowditch Ltd
Exstowe, Exton, Exeter, EX3 0PP, United Kingdom

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Legal entity name: Edward Bowditch Ltd
Legal entity form: Limited company
Business correspondence address: Exstowe, Exton, Exeter, EX3 0PP
Company registration number: 04916632
VAT registration: GB834241546
Authorised representative: Mr. E. Bowditch