Tong ho ming (35 resultados)

gebundene Ausgabe. Condición: Gut. 368 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 840.…

Hardcover. Condición: Fine. Hardcover in fine condition.

Hardcover. Condición: Fine. First Edition. PICTORIAL BOARDS.

Hardcover. Condición: Fine. First Edition. xvi, 319p. A fine copy, no d.j. Size: 8vo - over 7¾" - 9¾" tall. Book.

Hardcover. Condición: Fine unused copy. 1st. Octavo; xvi, 319 pages.

Hardcover. Condición: Very Good. John Wiley & Sons, Inc., 1990. In VG+ condition. No internal markings except for prior owner's signature inside front cover. DJ is like new except for bit of wear at top edge. NOT ex-library. Book.

Soft cover. Condición: New. Language:Chinese.Author:TAN LIU HOU MING DE ER TONG JU ZUO ZONG FU XIAN CHUANG ZUO YAN JIU.Binding.Publisher:Culture and Arts Publishing House.

Hardcover. Condición: Acceptable. Slight wear and tear, yellowing on dust jacket. Satisfaction 100% guaranteed.

Soft cover. Condición: New. Language:Chinese.Author:GAI BIAN TONG MENG HOU HUI HUA XU JIN GUO HUANG ZHI MING.Binding.Publisher:Shanghai People's Fine Arts Publishing House.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.…

Taschenbuch. Condición: Neu. Advanced Flip Chip Packaging | Ho-Ming Tong (u. a.) | Taschenbuch | vii | Englisch | 2016 | Springer | EAN 9781489979339 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Condición: New. In.

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.…

Condición: New. pp. 570.

Hardcover. Condición: Brand New. 2013 edition. 567 pages. 9.25x6.50x1.25 inches. In Stock.

Paperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condición: New. pp. 567.

Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

paperback. Condición: Good. Fisherman and Troll Books (fantasy) 64 open comics.

paperback. Condición: New. Paperback. Pub Date: 2021-06 Pages: 274 Language: Chinese Publisher: Tianjin University Press This book is divided into two parts and fourteen chapters. The theoretical part elaborates on the relevant theoretical knowledge of hotel supervision and practice from six aspects: team building. interpersonal communication. organizational motivation. quality management. grassroots training. and stress management; the operational part systematically summarizes the specific operations of hotel supervi.…

SOFTCOVER. Condición: Fine. 1st Edition. Square Quarto size (4to) in textured stiff card covers, 100pp, 12 artists each with a brief biography and a selection of their work printed in colour and b/w. This copy has been inscribed and signed in ink by Aser But on the blank page preceding his entry (no other marks or inscriptions) . [CONDITION: A near FINE clean and tight copy (few spots of slight shelf rub to cover edges) ] . . . We always ship in STRONG PROTECTIVE CARD PARCELS.…

paperback. Condición: Good. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Publisher: see Fig. Printing :2009 -01-01Four Satisfaction guaranteed,or money back.

Condición: new. Questo è un articolo print on demand.

Condición: new. Questo è un articolo print on demand.

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Broad-ranging chapters with a focus on IC-package-system integrationProvides viewpoints from leading industry executives and expertsDetails state-of-the-art achievements in process technologies and scientific researchPresents a clear.…

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. 568 pp. Englisch.…

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 568 pp. Englisch.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Broad-ranging chapters with a focus on IC-package-system integrationProvides viewpoints from leading industry executives and expertsDetails state-of-the-art achievements in process technologies and scientific researchPresents a clear.…

Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. 568 pp. Englisch.…