stapper c h (27 resultados)

Hard Cover. Condición: Very Good. No Jacket. First Edition. VG, hardback, maroon glazed board covers with white titles on spine turning purple, contents are clean and unmarked,large octavo 316pp. Ex-Admiralty Underwater Weapons Library. weight 750g. Ex-Library.

Condición: New. In.

Condición: New. In.

Condición: New.

Condición: New.

Condición: As New. Unread book in perfect condition.

Condición: New.

Condición: As New. Unread book in perfect condition.

Condición: New. pp. 336.

Condición: New. pp. 332.

Taschenbuch. Condición: Neu. Defect and Fault Tolerance in VLSI Systems | Volume 2 | C. H. Stapper (u. a.) | Taschenbuch | xiii | Englisch | 2013 | Humana | EAN 9781475799590 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an 'International Workshop on Designing for Yield' at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the 'IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems' in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an 'International Workshop on Designing for Yield' at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the 'IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems' in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.

Paperback. Condición: Brand New. reprint edition. 329 pages. 10.00x7.01x0.75 inches. In Stock.

Paperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condición: new. Questo è un articolo print on demand.

Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an 'International Workshop on Designing for Yield' at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the 'IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems' in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21. 334 pp. Englisch.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an 'International Workshop on Designing for Yield' at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the 'IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems' in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21. 332 pp. Englisch.

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of def.

Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of def.

Buch. Condición: Neu. Defect and Fault Tolerance in VLSI Systems | Volume 2 | C. H. Stapper (u. a.) | Buch | Einband - fest (Hardcover) | Englisch | 1990 | Springer US | EAN 9780306435317 | Verantwortliche Person für die EU: Springer Heidelberg, Tiergartenstr. 17, 69121 Heidelberg, buchhandel-buch[at]springer[dot]com | Anbieter: preigu Print on Demand.

Condición: New. Print on Demand pp. 336 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Condición: New. Print on Demand pp. 332 66:B&W 7 x 10 in or 254 x 178 mm Perfect Bound on White w/Gloss Lam.

Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an 'International Workshop on Designing for Yield' at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the 'IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems' in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 334 pp. Englisch.

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an 'International Workshop on Designing for Yield' at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the 'IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems' in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 332 pp. Englisch.

Condición: New. PRINT ON DEMAND pp. 336.

Condición: New. PRINT ON DEMAND pp. 332.