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Añadir al carritoHardcover. Condición: Very Good. Book is in very good plus condition, with crisp unmarked pages, tight binding, light overall wear. No cd-rom.
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Añadir al carritoSoftcover. Condición: Fair. Spuren von Feuchtigkeit / Nässe; Leichte Kratzer / Abnutzungen / Druckstellen.
Idioma: Inglés
Publicado por Vienna, Springer Wien., 2004
ISBN 10: 3211224688 ISBN 13: 9783211224687
Librería: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Alemania
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Añadir al carrito16 x 24 cm. XII, 379 S. XII, 379 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
Librería: Studibuch, Stuttgart, Alemania
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Añadir al carritohardcover. Condición: Gut. 562 Seiten; 9783527319039.3 Gewicht in Gramm: 2.
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Añadir al carritoCondición: New. pp. xii + 379.
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Añadir al carritoCondición: New. pp. xii + 379.
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Añadir al carritoTaschenbuch. Condición: Neu. Simulation of Semiconductor Processes and Devices 2004 | Gabriele Schrag (u. a.) | Taschenbuch | xii | Englisch | 2012 | Springer | EAN 9783709172124 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Añadir al carritoCondición: New. pp. 396.
EUR 213,99
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Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.
EUR 213,99
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Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.
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Añadir al carritoHardcover. Condición: Good. Good. Dust Jacket NOT present. CD WILL BE MISSING. . SHIPS FROM MULTIPLE LOCATIONS. book.
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Añadir al carritoPaperback. Condición: Brand New. reprint edition. 392 pages. 9.25x6.10x0.90 inches. In Stock.
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Añadir al carritoHardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Añadir al carritoCondición: new. Questo è un articolo print on demand.
Idioma: Inglés
Publicado por Springer Vienna Aug 2004, 2004
ISBN 10: 3211224688 ISBN 13: 9783211224687
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 149,79
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Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology. 396 pp. Englisch.
Librería: moluna, Greven, Alemania
EUR 180,07
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Añadir al carritoGebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary le.
Librería: moluna, Greven, Alemania
EUR 180,07
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary le.
Idioma: Inglés
Publicado por Springer Vienna Nov 2012, 2012
ISBN 10: 3709172128 ISBN 13: 9783709172124
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 213,99
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Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology. 396 pp. Englisch.
Librería: preigu, Osnabrück, Alemania
EUR 186,70
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Añadir al carritoBuch. Condición: Neu. Simulation of Semiconductor Processes and Devices 2004 | Gabriele Schrag (u. a.) | Buch | xii | Englisch | 2004 | Springer Vienna | EAN 9783211224687 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Idioma: Inglés
Publicado por Springer Vienna, Springer Vienna Aug 2004, 2004
ISBN 10: 3211224688 ISBN 13: 9783211224687
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 213,99
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Añadir al carritoBuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 396 pp. Englisch.
Idioma: Inglés
Publicado por Springer Vienna, Springer Nov 2012, 2012
ISBN 10: 3709172128 ISBN 13: 9783709172124
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 213,99
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 396 pp. Englisch.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 290,41
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Añadir al carritoCondición: New. Print on Demand pp. 396 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 293,11
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Añadir al carritoCondición: New. PRINT ON DEMAND pp. 396.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 293,88
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Añadir al carritoCondición: New. PRINT ON DEMAND pp. xii + 379.