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Sinopsis
This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004. The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world. Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.
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Reseña del editor
This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004. The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world. Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.
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- EditorialSpringer Verlag GmbH
- Año de publicación2004
- ISBN 10 3211224688
- ISBN 13 9783211224687
- EncuadernaciónTapa dura
- IdiomaInglés
- Número de páginas379
- EditorWachutka Gerhard, Schrag Gabriele
- Contacto del fabricanteno disponible
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Simulation of Semiconductor Processes and Devices 2004.
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Vienna, Springer Wien., 2004
ISBN 10: 3211224688
ISBN 13: 9783211224687
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16 x 24 cm. XII, 379 S. XII, 379 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch. Nº de ref. del artículo: 2841VB
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Simulation of Semiconductor Processes and Devices 2004
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Simulation of Semiconductor Processes and Devices 2004
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Springer Vienna Aug 2004, 2004
ISBN 10: 3211224688
ISBN 13: 9783211224687
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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology. 396 pp. Englisch. Nº de ref. del artículo: 9783211224687
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Simulation of Semiconductor Processes and Devices 2004
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Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary le. Nº de ref. del artículo: 4487769
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Simulation of Semiconductor Processes and Devices 2004
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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology. Nº de ref. del artículo: 9783211224687
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Simulation of Semiconductor Processes and Devices 2004
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Springer Vienna, Springer Vienna Aug 2004, 2004
ISBN 10: 3211224688
ISBN 13: 9783211224687
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Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 396 pp. Englisch. Nº de ref. del artículo: 9783211224687
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Simulation of Semiconductor Processes and Devices 2004
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Condición: New. PRINT ON DEMAND pp. xii + 379. Nº de ref. del artículo: 1858589334
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Simulation of Semiconductor Processes and Devices 2004
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Hardcover. Condición: Like New. Like New. book. Nº de ref. del artículo: ERICA75832112246885
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