Puttlitz karl (13 resultados)
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Librería: medimops, Berlin, Alemaniamedimops
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EUR 4,38
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Condición: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.
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Librería: moluna, Greven, Alemaniamoluna
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EUR 48,37
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Condición: New.
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 53,49
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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and inter…connection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
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Librería: Mispah books, Redhill, SURRE, Reino UnidoMispah books
Contactar con el vendedorVendedor de 4 estrellasCondición: Usado - Como Nuevo
EUR 196,21
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Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Librería: Basi6 International, Irving, TX, Estados Unidos de AmericaBasi6 International
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EUR 260,49
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Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Idioma: Inglés
Editorial: Marcel Dekker Inc, 2004
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Librería: Anybook.com, Lincoln, Reino UnidoAnybook.com
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EUR 270,85
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Condición: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,2050grams, ISBN:9780824748708….
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Editorial: Münster, Aschendorff 1822., 1822
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Librería: Antiquariat Uwe Turszynski, München, AlemaniaAntiquariat Uwe Turszynski
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EUR 120,00
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Añadir al carrito128 S. Moderner Pappband. Goed. VI, 468, 67, 5. - Karl Friedrich Edler von Puttlitz (1777-1822) war preußischer Regierungsrat in Plock/Neu-Ostpreußen. Ging 1809 nach Wien. War später Regierungsrat in Kleve und 1820 Oberlandesgerichtsrat in Münster. - Gebräunt.
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Librería: Basi6 International, Irving, TX, Estados Unidos de AmericaBasi6 International
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EUR 61,00
Gastos de envío gratisSe envía dentro de Estados Unidos de AmericaCantidad disponible: 10 disponibles
Condición: Brand New. New. Delivery takes 20-25 days. Print on Demand.
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Librería: True World of Books, Delhi, IndiaTrue World of Books
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EUR 33,01
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Añadir al carritoLeatherBound. Condición: NEW. LeatherBound edition. Condition: New. Reprinted from 1817 edition. Leather Binding on Spine and Corners with Golden leaf printing on spine. Bound in genuine leather with Satin ribbon page markers and Spine with raised gilt bands. A perfect gift for your loved ones. NO changes have been made to the o…riginal text. This is NOT a retyped or an ocr'd reprint. Illustrations, Index, if any, are included in black and white. Each page is checked manually before printing. As this print on demand book is reprinted from a very old book, there could be some missing or flawed pages, but we always try to make the book as complete as possible. Fold-outs, if any, are not part of the book. If the original book was published in multiple volumes then this reprint is of only one volume, not the whole set. Sewing binding for longer life, where the book block is actually sewn (smythe sewn/section sewn) with thread before binding which results in a more durable type of binding. Pages: 184.
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 53,49
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external…wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. 1332 pp. Englisch.
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
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EUR 53,49
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiri…ng and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 1332 pp. Englisch.
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Librería: preigu, Osnabrück, Alemaniapreigu
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EUR 50,25
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Taschenbuch. Condición: Neu. Area Array Interconnection Handbook | Paul A. Totta (u. a.) | Taschenbuch | 2 Taschenbücher | Englisch | 2012 | Springer US | EAN 9781461355298 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu P…rint on Demand.
Idioma: Inglés
Editorial: CRC Press, 2004
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Librería: Basi6 International, Irving, TX, Estados Unidos de AmericaBasi6 International
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EUR 414,01
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Condición: Brand New. New. Delivery takes 20-25 days. Print on Demand.
