Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering) - Tapa dura

Libro 71 de 115: Mechanical Engineering

Puttlitz, Karl J.; Stalter, Kathleen A.

 
9780824748708: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering)
Tapa dura
ISBN 10: 0824748700 ISBN 13: 9780824748708
Editorial: CRC Press, 2004

Sinopsis

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

"Sinopsis" puede pertenecer a otra edición de este libro.

Acerca del autor

Karl J. Puttlitz, Kathleen A. Stalter

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
CRC Press
Año de publicación
2004
Idioma
Inglés
ISBN 10 
0824748700
ISBN 13 
9780824748708
Encuadernación
Tapa dura
Número de edición
1
Número de páginas
1044
Contacto del fabricante
Taylor and Francis, GPSR Taylor and Francis
gpsr@taylorandfrancis.com

Taylor & Francis Verlag GmbH, Kaufingerstraße 24
München
80331
Alemania

Otras ediciones populares con el mismo título

9780071383370: Handbook of Lead-Free Solder Technology: For Microelectronic Assemblies (Engineering Handbook)

Edición Destacada

ISBN 10:  0071383379 ISBN 13:  9780071383370
Editorial: McGraw Hill Higher Education, 2002
Tapa dura