Area Array Interconnection Handbook (Paperback)

Idioma: inglés

Editorial: Springer-Verlag New York Inc., New York, NY, 2012

146135529X / 9781461355298

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Paperback. Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

N° de ref. del artículo 9781461355298

Título
Area Array Interconnection Handbook (Paperback)
Autor
Karl J. Puttlitz
Editorial
Springer-Verlag New York Inc., New York, NY
Año de publicación
2012
Estado
new
Encuadernación
Paperback
Idioma
inglés
ISBN 10
146135529X
ISBN 13
9781461355298

AussieBookSeller

Truganina, VIC, Australia

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Vendedor de AbeBooks desde 22 de junio de 2007

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Truganina, VIC Australia 3029