Ehrenfried zschech (80 resultados)

Hardcover/Pappeinband. Condición: Sehr gut. 527 p. Very good. Shrink wrapped. / Sehr guter Zustand. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 984.

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Hardback or Cased Book. Condición: New. Characterization of Nanomaterials. Book.

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Hardback. Condición: New.

Condición: New.

Hardback. Condición: New.

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hardcover. Condición: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

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Gebunden. Condición: Neu. Neu -Innovative Werkstoffe werden zukünftig ebenso wie Hochtechnologien mehr und mehr den wirtschaftlichen und gesellschaftlichen Fortschritt eines Landes, einer Region, ja der gesamten Welt bestimmen. Das vorliegende Buch vermittelt Werkstoffvisionen für das nächste Jahrhundert, vor allem aber realistische Entwicklungstrends. 150 pp. Deutsch.…

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Hardcover. Condición: Near Fine. 3rd Edition. 3rd ed.hardback book in near fine condition.

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Hardback. Condición: New.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Pp. Condición: Gut. 1. Aufl. 150 S. : Ill., graph. Darst. ; 25 cm gutes bis sehr gutes Exemplar Aufgrund der neuen PPWR-Bestimmungen (EU-Verpackungsverordnung) liefern wir derzeit nicht in EU-Mitgliedstaaten. Due to the new PPWR regulations (EU Packaging and Packaging Waste Regulation), we currently do not ship to EU Member States. Sprache: Deutsch Gewicht in Gramm: 472.…

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Condición: Used. pp. 532.

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Condición: Used. pp. 532 Illus.

Condición: Used. pp. 532.

Condición: New.

Condición: New.

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Taschenbuch. Condición: Neu. Materials for Information Technology | Devices, Interconnects and Packaging | Ehrenfried Zschech (u. a.) | Taschenbuch | Engineering Materials and Processes | xix | Englisch | 2010 | Springer | EAN 9781849969673 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Condición: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . …

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and materials for assembly and packaging The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.…

Gebunden. Condición: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.