Bar cohen avram editor (14 resultados)

Hardcover. Condición: Brand New. 214 pages. 6.69x0.50x9.61 inches. In Stock.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Hardcover. Condición: Brand New. 318 pages. 6.69x0.75x9.61 inches. In Stock.

Buch. Condición: Neu. Neuware - Thermal and mechanical packaging the enabling technologies for the physical implementation of electronic systems are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and gradua.…

Gebunden. Condición: New. Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, an.

Condición: New. In English.

Condición: Used.

Hardcover. Condición: Brand New. 434 pages. 6.69x0.94x9.61 inches. In Stock.

Hardcover. Condición: Brand New. 436 pages. 6.69x0.94x9.61 inches. In Stock.

Hardcover. Condición: Brand New. 1080 pages. 10.08x7.60x2.72 inches. In Stock.

Condición: Used.

Condición: Used.

Hardcover. Condición: Brand New. 888 pages. 10.00x6.75x2.25 inches. In Stock.