Arulmurugan loganathan (12 resultados)
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
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Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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Librería: Chiron Media, Wallingford, , Reino UnidoChiron Media
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A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
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Librería: Books Puddle, New York, NY, Estados Unidos de AmericaBooks Puddle
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Librería: preigu, Osnabrück, Alemaniapreigu
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Taschenbuch. Condición: Neu. A Transient Study on Heat Dissipation Problem in Microelectronics | An overview of thermal management for next generation microelectronic devices | Arulmurugan Loganathan (u. a.) | Taschenbuch | 52 S. | Englisch | 2020 | LAP LAMBERT Academic Publishing | EAN 9786202556989 | Verantwortliche Person für… die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
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Librería: PBShop.store US, Wood Dale, IL, Estados Unidos de AmericaPBShop.store US
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EUR 42,49
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PAP. Condición: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Librería: PBShop.store UK, Fairford, GLOS, Reino UnidoPBShop.store UK
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EUR 41,25
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PAP. Condición: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , AlemaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat sin…ks could improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics. 52 pp. Englisch.
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
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Librería: Majestic Books, Hounslow, , Reino UnidoMajestic Books
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EUR 66,06
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Condición: New. Print on Demand.
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
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Librería: Biblios, frankfurt am main, HESSE, AlemaniaBiblios
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EUR 66,88
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Condición: New. PRINT ON DEMAND.
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Librería: moluna, Greven, , Alemaniamoluna
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EUR 34,25
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Loganathan ArulmuruganArulmurugan Loganathan is working as an Assistant Professor in the Department of Electronics and Communication Engineering, Bannari Amman Institute of Technology, Sathyamangalam, E…rode, Tamilnadu, India. His res.
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
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EUR 39,90
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat sinks c…ould improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 52 pp. Englisch.
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 40,89
Envío por EUR 60,48Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat sinks co…uld improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics.
