Avram bar cohen (62 resultados)

Condición: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Hardcover. Condición: with no dust jacket. No Dust Jacket. Volume 2. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Light bumping on spine extremities and board corners. Pages clean, but for library markings. ; TEH22A; 437 pages; Ex-Library.

Hardcover. Condición: Acceptable. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: Used. pp. 402.

Condición: Good. Good++; Hardcover; Covers are still glossy; Unblemished textblock edges; Name inside the front cover; Highlighting to about 10 pages, otherwise text pages are all clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); 1.6 lbs; Light blue covers with title in black lettering; 1995, Wiley-Interscience Publishing; 424 pages; "Design and Analysis of Heat Sinks," by Allan D. Kraus & Avram Bar-Cohen.…

hardcover. Ships same or next business day.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: New. pp. 220.

Hardcover. Condición: New.

Hardcover. Condición: Fine. No Dust Jacket. 9.2 X 6.4 X 1.1 inches; 424 pages.

Condición: New. pp. 220 14:B&W 6 x 9 in or 229 x 152 mm Case Laminate on White w/Gloss Lam.

Condición: New. pp. 220.

Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condición: New.

Condición: As New. Unread book in perfect condition.

Condición: New.

Condición: As New. Unread book in perfect condition.

Condición: New. In English.

Condición: New.

Hardback. Condición: New. A powerful methodology for producing superior thermal performanceat low cost with minimum added mass . . . Here is the only available comprehensive treatment of the designand analysis of heat sinks. It provides all the theoretical andpractical information necessary to successfully design and/orselect cost-effective heat sinks for electronic equipment. Thepresentation includes detailed explanations of the governing heattransfer phenomena, complete coverage of thermal modeling tools forgeometrically complex fin structures, and extensive discussion onrecognizing thermal optimization opportunities. Other topics covered include: * Fundamentals of heat transfer * Thermal modeling of electronic packages * Mathematical tools for heat-sink analysis and design * Prevailing thermal transport processes * Models for a variety of fin geometries * Simple "transfer function" relations for single fin, cascadedfin, and fin array heat sinks * Thermal characterization and optimization of plate-fin heatsinks Completely self-contained and filled with valuable information notavailable from any other single source, Design and Analysis of HeatSinks is both a superior reference for accomplished thermalspecialists and an excellent textbook for graduate courses inadvanced thermal applications for mechanical engineering students.This book can also serve as a text in thermal science for studentsof electrical engineering.…

Hardcover. Condición: new. New Copy. Customer Service Guaranteed.

Condición: New. pp. 424.

Condición: New. pp. 424 1st Edition.

Hardcover. Condición: New.

Hardcover. Condición: Acceptable. Dust Jacket NOT present. CD WILL BE MISSING. SHIPS FROM MULTIPLE LOCATIONS. book.

Hardcover. Condición: Brand New. 1st edition. 407 pages. 9.50x6.50x1.00 inches. In Stock.

Buch. Condición: Neu. Neuware - A powerful methodology for producing superior thermal performanceat low cost with minimum added mass . . . Here is the only available comprehensive treatment of the designand analysis of heat sinks. It provides all the theoretical andpractical information necessary to successfully design and/orselect cost-effective heat sinks for electronic equipment. Thepresentation includes detailed explanations of the governing heattransfer phenomena, complete coverage of thermal modeling tools forgeometrically complex fin structures, and extensive discussion onrecognizing thermal optimization opportunities. Other topics covered include: \* Fundamentals of heat transfer \* Thermal modeling of electronic packages \* Mathematical tools for heat-sink analysis and design \* Prevailing thermal transport processes \* Models for a variety of fin geometries \* Simple 'transfer function' relations for single fin, cascadedfin, and fin array heat sinks \* Thermal characterization and optimization of plate-fin heatsinks Completely self-contained and filled with valuable information notavailable from any other single source, Design and Analysis of HeatSinks is both a superior reference for accomplished thermalspecialists and an excellent textbook for graduate courses inadvanced thermal applications for mechanical engineering students.This book can also serve as a text in thermal science for studentsof electrical engineering.…

Hardback. Condición: New. A powerful methodology for producing superior thermal performanceat low cost with minimum added mass . . . Here is the only available comprehensive treatment of the designand analysis of heat sinks. It provides all the theoretical andpractical information necessary to successfully design and/orselect cost-effective heat sinks for electronic equipment. Thepresentation includes detailed explanations of the governing heattransfer phenomena, complete coverage of thermal modeling tools forgeometrically complex fin structures, and extensive discussion onrecognizing thermal optimization opportunities. Other topics covered include: * Fundamentals of heat transfer * Thermal modeling of electronic packages * Mathematical tools for heat-sink analysis and design * Prevailing thermal transport processes * Models for a variety of fin geometries * Simple "transfer function" relations for single fin, cascadedfin, and fin array heat sinks * Thermal characterization and optimization of plate-fin heatsinks Completely self-contained and filled with valuable information notavailable from any other single source, Design and Analysis of HeatSinks is both a superior reference for accomplished thermalspecialists and an excellent textbook for graduate courses inadvanced thermal applications for mechanical engineering students.This book can also serve as a text in thermal science for studentsof electrical engineering.…