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Advances in Thermal Modelling of Electronic Components and Systems v. 3: 4 - Tapa dura

 
9780791800652: Advances in Thermal Modelling of Electronic Components and Systems v. 3: 4

Sinopsis

This volume of the series focuses on air cooling technology. Begins with a review of techniques used in thermal analysis of natural convection electronic systems, and continues with the presentation of a methodology for thermal modeling of air cooled components mounted on printed circuit boards. Gov

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Reseña del editor

This volume of the series focuses on air cooling technology. Begins with a review of techniques used in thermal analysis of natural convection electronic systems, and continues with the presentation of a methodology for thermal modeling of air cooled components mounted on printed circuit boards. Gov

Biografía del autor

Kraus, ADK Associates, Aurora, Ohio.

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