Librería: Anybook.com, Lincoln, Reino Unido
EUR 2,99
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,600grams, ISBN:9780412617300.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 60,57
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 74,89
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. pp. 324.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 79,73
Cantidad disponible: 2 disponibles
Añadir al carritoPaperback. Condición: Brand New. 324 pages. 9.61x6.69x0.68 inches. In Stock.
Librería: moluna, Greven, Alemania
EUR 48,37
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 53,49
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
Librería: preigu, Osnabrück, Alemania
EUR 50,35
Cantidad disponible: 5 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Technology CAD Systems | Franz Fasching (u. a.) | Taschenbuch | viii | Englisch | 2012 | Springer | EAN 9783709193174 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Librería: Phatpocket Limited, Waltham Abbey, HERTS, Reino Unido
EUR 120,60
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 110,89
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 166,93
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Very Good. Dust Jacket may NOT BE INCLUDED.CDs may be missing. SHIPS FROM MULTIPLE LOCATIONS. book.
Idioma: Inglés
Publicado por New York, NY, U.S.A.: Chapman & Hall, 1995, 1994
ISBN 10: 0412617307 ISBN 13: 9780412617300
Librería: White Raven Books, Ypsilanti, MI, Estados Unidos de America
EUR 201,10
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Near Fine. 6"x9.5". Shiny yellow paper over boards; an almost fine ex library copy with no dust jacket; "This book presents a state-of-the-art review of feature techniques in CAD/CAM.The key feature modelling issues addressed are: organization, management, representation, recognition, and validation.".
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 238,02
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 225,40
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 225,39
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 245,59
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 241,97
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 303,66
Cantidad disponible: 1 disponibles
Añadir al carritoBuch. Condición: Neu. Neuware - This book provides up-to-date information about the promising use of feature technology for integrating computer-aided-design with subsequent applications. The book consists of 20 articles based upon the international IFIP conference on this topic held in Valenciennes, France in May 1994.
Librería: Celler Versandantiquariat, Eicklingen, Alemania
Miembro de asociación: GIAQ
EUR 27,00
Cantidad disponible: 1 disponibles
Añadir al carritoSpringer, Wien, 1993. VIII, 309 pages with 199 figures, hard cover, (former library book)--- 736 Gramm.
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 46,22
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: new. Questo è un articolo print on demand.
Idioma: Inglés
Publicado por Springer Vienna Jan 2012, 2012
ISBN 10: 3709193176 ISBN 13: 9783709193174
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 53,49
Cantidad disponible: 2 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools. 324 pp. Englisch.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 77,95
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. Print on Demand pp. 324 199 Figures, 67:B&W 6.69 x 9.61 in or 244 x 170 mm (Pinched Crown) Perfect Bound on White w/Gloss Lam.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 72,88
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. PRINT ON DEMAND pp. 324.
Idioma: Inglés
Publicado por Springer Vienna, Springer Jan 2012, 2012
ISBN 10: 3709193176 ISBN 13: 9783709193174
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 53,49
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 324 pp. Englisch.