Microsystem based sip technology (23 resultados)
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Condición: Hervorragend. Zustand: Hervorragend | Seiten: 892 | Sprache: Englisch | Produktart: Bücher | This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new origina…l concepts and thoughts, such as Function Density Law,Si³P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
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Librería: California Books, Miami, FL, Estados Unidos de AmericaCalifornia Books
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Taschenbuch. Condición: Neu. MicroSystem Based on SiP Technology | Suny Li | Taschenbuch | xviii | Englisch | 2023 | Springer Singapore | EAN 9789811900853 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Paperback. Condición: Brand New. 892 pages. 9.25x6.10x1.76 inches. In Stock.
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Hardcover. Condición: gut. 2022. MicroSystem Based on SiP Technology In deutscher Sprache. pages.
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Condición: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.
Idioma: Inglés
Editorial: Springer Nature Singapore, Springer Nature Singapore, 2022
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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such… as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
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Librería: liu xing, Nanjing, JS, Chinaliu xing
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paperback. Condición: New. Paperback. Pub Date: 2021-05-01 Pages: 652 Language: Chinese Publisher: Electronic Industry Press This book uses a combination of original concepts. hot technologies and actual cases to describe the entire process of SiP technology from concept to realization.?The book is divided into three parts: conc…ept and technology. design and simulation. project and case. a total of 30 chapters.?Based on the development of SiP and advanced packaging technology. as well as the author's many years of expe.
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A comprehensive SiP design guide bookDescribes the whole process of SiPCombines the original concepts, hot technology and practical casesMr. Suny Li (Li Yang) is a SiP technical expert with 20 years of working experie…nce. He has .
Idioma: Inglés
Editorial: Springer Nature Singapore, Springer Nature Singapore Mai 2023, 2023
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original conc…epts and thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it. 892 pp. Englisch.
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Editorial: Springer Nature Singapore, Springer Nature Singapore Mai 2023, 2023
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters.In Part one, the author proposes some new original concepts…and thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 892 pp. Englisch.
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Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts…and thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
Idioma: Inglés
Editorial: Springer, Berlin|Springer Nature Singapore|Publishing House of Electronics Industry|Springer, 2022
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Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author propos…es some new original concepts and though.
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Editorial: Springer Nature Singapore, Springer Nature Singapore Mai 2022, 2022
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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts an…d thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it. 892 pp. Englisch.
Idioma: Inglés
Editorial: Springer Nature Singapore, Springer Nature Singapore Mai 2022, 2022
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Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters.In Part one, the author proposes some new original concepts and tho…ughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 892 pp. Englisch.
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