Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 73,59
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoCondición: New. pp. 290.
EUR 74,56
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoCondición: New. pp. 290 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 76,50
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoCondición: New. pp. 290.
Librería: Basi6 International, Irving, TX, Estados Unidos de America
EUR 100,26
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoCondición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Librería: Romtrade Corp., STERLING HEIGHTS, MI, Estados Unidos de America
EUR 100,26
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoCondición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Librería: Pistil Books Online, IOBA, Seattle, WA, Estados Unidos de America
Miembro de asociación: IOBA
EUR 96,76
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoHard Cover. Condición: Fine. No Jacket. A clean, unmarked book with a tight binding. 278 pages.
Librería: ALLBOOKS1, Direk, SA, Australia
EUR 109,08
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoBrand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.
Publicado por Springer-Verlag New York Inc., New York, NY, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Idioma: Inglés
Librería: Grand Eagle Retail, Mason, OH, Estados Unidos de America
EUR 113,63
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: new. Paperback. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 111,30
Convertir monedaCantidad disponible: 15 disponibles
Añadir al carritoCondición: New.
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
EUR 112,28
Convertir monedaCantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: Patrico Books, Apollo Beach, FL, Estados Unidos de America
EUR 122,00
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritohardcover. Condición: As New. Ships Out Tomorrow!
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 132,31
Convertir monedaCantidad disponible: 15 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 128,21
Convertir monedaCantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 139,71
Convertir monedaCantidad disponible: 15 disponibles
Añadir al carritoCondición: New. 2012. Paperback. . . . . .
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 155,15
Convertir monedaCantidad disponible: 15 disponibles
Añadir al carritoCondición: New.
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
EUR 158,11
Convertir monedaCantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Publicado por Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Idioma: Inglés
Librería: Grand Eagle Retail, Mason, OH, Estados Unidos de America
EUR 181,55
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: new. Hardcover. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Librería: Kennys Bookstore, Olney, MD, Estados Unidos de America
EUR 175,77
Convertir monedaCantidad disponible: 15 disponibles
Añadir al carritoCondición: New. 2012. Paperback. . . . . . Books ship from the US and Ireland.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 185,50
Convertir monedaCantidad disponible: 15 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Publicado por Springer US, Springer New York, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Idioma: Inglés
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 120,54
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
EUR 90,47
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoCondición: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 181,59
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: Like New. Like New. book.
EUR 166,62
Convertir monedaCantidad disponible: 2 disponibles
Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Publicado por Springer-Verlag New York Inc., New York, NY, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Idioma: Inglés
Librería: AussieBookSeller, Truganina, VIC, Australia
EUR 205,71
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: new. Paperback. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 216,01
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Like New. Like New. book.
Publicado por Springer-Verlag New York Inc., 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Idioma: Inglés
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 226,71
Convertir monedaCantidad disponible: 15 disponibles
Añadir al carritoCondición: New. 3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. Editor(s): Sheibanyrad, Abbas; Petrot, Frederic; Jantsch, Axel. Series: Integrated Circuits and Systems. Num Pages: 278 pages, biography. BIC Classification: TJFC; UMZ. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 17. Weight in Grams: 584. . 2010. Hardback. . . . .
Publicado por Springer-Verlag New York Inc., 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Idioma: Inglés
Librería: Kennys Bookstore, Olney, MD, Estados Unidos de America
EUR 285,52
Convertir monedaCantidad disponible: 15 disponibles
Añadir al carritoCondición: New. 3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. Editor(s): Sheibanyrad, Abbas; Petrot, Frederic; Jantsch, Axel. Series: Integrated Circuits and Systems. Num Pages: 278 pages, biography. BIC Classification: TJFC; UMZ. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 17. Weight in Grams: 584. . 2010. Hardback. . . . . Books ship from the US and Ireland.
Publicado por Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Idioma: Inglés
Librería: AussieBookSeller, Truganina, VIC, Australia
EUR 302,46
Convertir monedaCantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: new. Hardcover. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Publicado por Springer New York Dez 2012, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Idioma: Inglés
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 117,69
Convertir monedaCantidad disponible: 2 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 288 pp. Englisch.
Librería: moluna, Greven, Alemania
EUR 98,54
Convertir monedaCantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-.