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Añadir al carritoTaschenbuch. Condición: Neu. 3D Integration for NoC-based SoC Architectures | Abbas Sheibanyrad (u. a.) | Taschenbuch | x | Englisch | 2012 | Springer New York | EAN 9781461427483 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Publicado por Springer US, Springer New York, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Idioma: Inglés
Librería: AHA-BUCH GmbH, Einbeck, Alemania
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Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
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Añadir al carritoCondición: Hervorragend. Zustand: Hervorragend | Seiten: 278 | Sprache: Englisch | Produktart: Bücher | Back Cover CopySERIES:Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors)Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. ¿Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; ¿Covers the entire architectural design approach for 3D-SoCs;¿Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures.
Librería: Mispah books, Redhill, SURRE, Reino Unido
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Añadir al carritoPaperback. Condición: Like New. Like New. book.
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Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Librería: Mispah books, Redhill, SURRE, Reino Unido
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Añadir al carritoHardcover. Condición: Like New. Like New. book.
Publicado por Springer New York Dez 2012, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Idioma: Inglés
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 117,69
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Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 288 pp. Englisch.
Librería: moluna, Greven, Alemania
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-.
Publicado por Springer US, Springer New York Dez 2012, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Idioma: Inglés
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 117,69
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Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 288 pp. Englisch.
Publicado por SPRINGER NATURE Dez 2010, 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Idioma: Inglés
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 160,49
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Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 278 pp. Englisch.
Librería: moluna, Greven, Alemania
EUR 137,26
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Añadir al carritoGebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-.