3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
ISBN 10: 1461427487 ISBN 13: 9781461427483
Editorial: Springer, 2012
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In. N° de ref. del artículo ria9781461427483_new
Sinopsis:
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
De la contraportada: Back Cover CopySERIES:Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors)Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; Covers the entire architectural design approach for 3D-SoCs; Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures.
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Título: 3D Integration for NoC-based SoC ...
Editorial: Springer
Año de publicación: 2012
Encuadernación: Encuadernación de tapa blanda
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-. Nº de ref. del artículo: 4197730
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Taschenbuch. Condición: Neu. 3D Integration for NoC-based SoC Architectures | Abbas Sheibanyrad (u. a.) | Taschenbuch | x | Englisch | 2012 | Springer New York | EAN 9781461427483 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Nº de ref. del artículo: 106094547
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
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3D Integration for NoC-based SoC Architectures
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ISBN 10: 1461427487
ISBN 13: 9781461427483
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 288 pp. Englisch. Nº de ref. del artículo: 9781461427483
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ISBN 10: 1461427487
ISBN 13: 9781461427483
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 288 pp. Englisch. Nº de ref. del artículo: 9781461427483
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3D Integration for NoC-based SoC Architectures
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ISBN 10: 1461427487
ISBN 13: 9781461427483
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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. Nº de ref. del artículo: 9781461427483
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