This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
"Sinopsis" puede pertenecer a otra edición de este libro.
Back Cover CopySERIES:Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors)Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; Covers the entire architectural design approach for 3D-SoCs; Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures.
"Sobre este título" puede pertenecer a otra edición de este libro.
EUR 14,90 gastos de envío desde Alemania a España
Destinos, gastos y plazos de envíoEUR 9,82 gastos de envío desde Estados Unidos de America a España
Destinos, gastos y plazos de envíoLibrería: Books Puddle, New York, NY, Estados Unidos de America
Condición: New. pp. 290. Nº de ref. del artículo: 262204918
Cantidad disponible: 1 disponibles
Librería: Majestic Books, Hounslow, Reino Unido
Condición: New. pp. 290 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam. Nº de ref. del artículo: 5643049
Cantidad disponible: 1 disponibles
Librería: Biblios, Frankfurt am main, HESSE, Alemania
Condición: New. pp. 290. Nº de ref. del artículo: 182204924
Cantidad disponible: 1 disponibles
Librería: Romtrade Corp., STERLING HEIGHTS, MI, Estados Unidos de America
Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Nº de ref. del artículo: ABNR-81762
Cantidad disponible: 1 disponibles
Librería: Buchpark, Trebbin, Alemania
Condición: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher. Nº de ref. del artículo: 8539990/1
Cantidad disponible: 1 disponibles
Librería: Basi6 International, Irving, TX, Estados Unidos de America
Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Nº de ref. del artículo: ABEJUNE24-174546
Cantidad disponible: 1 disponibles
Librería: Pistil Books Online, IOBA, Seattle, WA, Estados Unidos de America
Hard Cover. Condición: Fine. No Jacket. A clean, unmarked book with a tight binding. 278 pages. Nº de ref. del artículo: 133586
Cantidad disponible: 1 disponibles
Librería: moluna, Greven, Alemania
Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-. Nº de ref. del artículo: 4176380
Cantidad disponible: Más de 20 disponibles
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 278 pp. Englisch. Nº de ref. del artículo: 9781441976178
Cantidad disponible: 2 disponibles
Librería: Ria Christie Collections, Uxbridge, Reino Unido
Condición: New. In. Nº de ref. del artículo: ria9781441976178_new
Cantidad disponible: Más de 20 disponibles