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Publicado por LAP LAMBERT Academic Publishing, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
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Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
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Añadir al carritoPAP. Condición: New. New Book. Shipped from UK. Established seller since 2000.
Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
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Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
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Añadir al carritoPaperback. Condición: Brand New. 52 pages. 5.91x0.12x8.66 inches. In Stock.
Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing Mai 2021, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
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Añadir al carritoTaschenbuch. Condición: Neu. Neuware -Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations.
Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing Mai 2021, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
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Añadir al carritoTaschenbuch. Condición: Neu. Neuware -Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations.Books on Demand GmbH, Überseering 33, 22297 Hamburg 52 pp. Englisch.
Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing Mai 2021, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
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Añadir al carritoTaschenbuch. Condición: Neu. Neuware - Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations.
Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
Librería: preigu, Osnabrück, Alemania
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Añadir al carritoTaschenbuch. Condición: Neu. CFD Analysis of Heat Transfer problems | Simulation with ANSYS FLUENT | Chepuri Srinivasa Rao | Taschenbuch | Englisch | 2021 | LAP LAMBERT Academic Publishing | EAN 9786203857481 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
ISBN 10: 6203857483 ISBN 13: 9786203857481
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Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing Mai 2021, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
Librería: Books-by-Floh, Paderborn, Alemania
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Añadir al carritoTaschenbuch. Condición: Neu. Neuware -Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations. 52 pp. Englisch.
ISBN 10: 6203857483 ISBN 13: 9786203857481
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ISBN 10: 6203857483 ISBN 13: 9786203857481
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ISBN 10: 6203857483 ISBN 13: 9786203857481
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Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
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Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
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Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing Mai 2021, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
Librería: Rheinberg-Buch Andreas Meier eK, Bergisch Gladbach, Alemania
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Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations. 52 pp. Englisch.
Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing Mai 2021, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 39,90
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Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations. 52 pp. Englisch.
Idioma: Inglés
Publicado por LAP LAMBERT Academic Publishing, 2021
ISBN 10: 6203857483 ISBN 13: 9786203857481
Librería: moluna, Greven, Alemania
EUR 34,25
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Srinivasa Rao ChepuriDr.Ch.Srinivasa Rao, is presently working as a Professor of Mechanical Engineering in Kallam Haranadhareddy Institute of Technology, Chowdavaram, Guntur, Andhra Pradesh, INDIA. He has 22 years of teaching experie.