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Librería: SpringBooks, Berlin, Alemania
Original o primera edición
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Añadir al carritoHardcover. Condición: As New. 1. Auflage. Unread, like new. Immediately dispatched from Germany.
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Idioma: Inglés
Publicado por Springer Berlin Heidelberg, 2016
ISBN 10: 366249681X ISBN 13: 9783662496817
Librería: moluna, Greven, Alemania
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Publicado por Springer Berlin Heidelberg, 2016
ISBN 10: 366249681X ISBN 13: 9783662496817
Librería: AHA-BUCH GmbH, Einbeck, Alemania
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Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600 and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10-7 -cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.
Librería: Buchpark, Trebbin, Alemania
EUR 17,34
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Añadir al carritoCondición: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600¿ and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10¿7¿¿cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
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Añadir al carritoCondición: new. Questo è un articolo print on demand.
Idioma: Inglés
Publicado por Springer Berlin Heidelberg Jun 2016, 2016
ISBN 10: 366249681X ISBN 13: 9783662496817
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
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Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600 and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10-7 -cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node. 80 pp. Englisch.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 72,96
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Añadir al carritoCondición: New. Print on Demand pp. 59.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
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Añadir al carritoCondición: New. PRINT ON DEMAND pp. 59.
Idioma: Inglés
Publicado por Springer, Springer Jun 2016, 2016
ISBN 10: 366249681X ISBN 13: 9783662496817
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 53,49
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Añadir al carritoBuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600¿ and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10¿7¿¿cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 80 pp. Englisch.
Librería: preigu, Osnabrück, Alemania
EUR 50,25
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Añadir al carritoBuch. Condición: Neu. The Source/Drain Engineering of Nanoscale Germanium-based MOS Devices | Zhiqiang Li | Buch | Springer Theses | xiv | Englisch | 2016 | Springer | EAN 9783662496817 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.