9783659833366 - Polymer Composites for Microelectronic Applications: Micro-sized Particulate Filled Polymer Composites de Agrawal, Alok; Satapathy, Alok (9 resultados)

Paperback. Condición: Brand New. 212 pages. 8.66x5.91x0.48 inches. In Stock.

Condición: New.

Taschenbuch. Condición: Neu. Polymer Composites for Microelectronic Applications | Micro-sized Particulate Filled Polymer Composites | Alok Agrawal (u. a.) | Taschenbuch | 212 S. | Englisch | 2016 | LAP LAMBERT Academic Publishing | EAN 9783659833366 | Verantwortliche Person für die EU: BoD - Books on Demand, In de Tarpen 42, 22848 Norderstedt, info[at]bod[dot]de | Anbieter: preigu.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The objective of the book is to report on the possibility of using ceramic fillers in polymers to make composites suitable for microelectronic applications. The first part of the book is on the development of theoretical heat conduction models for estimation of effective thermal conductivity of such polymer composites with single/hybrid fillers. The second part has provided the description of the materials used, routes adopted to fabricate the various composites and the details of the experiments. The last part has emphasized on the physical, mechanical, thermal and dielectric characteristics of all the epoxy and polypropylene based composites filled with single filler i.e. micro-sized AlN/Al2O3. A comparative evaluation of the effects of premixing of solid glass microspheres with AlN/Al2O3 is also presented. The polymer composites developed with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric constant are expected to have adequate potential for a wide variety of applications particularly in microelectronic industries like electronic packaging, encapsulations, printed circuit board substrates etc. 212 pp. Englisch.

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Agrawal AlokDr. Alok Agrawal, an eminent researcher having academic and industrial experience with many research publications to his credit is well known in the field of Composite Materials. Dr.Alok Satapathy, Asso. Prof. of Mechanic.

Condición: New. Print on Demand.

Condición: New. PRINT ON DEMAND.

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The objective of the book is to report on the possibility of using ceramic fillers in polymers to make composites suitable for microelectronic applications. The first part of the book is on the development of theoretical heat conduction models for estimation of effective thermal conductivity of such polymer composites with single/hybrid fillers. The second part has provided the description of the materials used, routes adopted to fabricate the various composites and the details of the experiments. The last part has emphasized on the physical, mechanical, thermal and dielectric characteristics of all the epoxy and polypropylene based composites filled with single filler i.e. micro-sized AlN/Al2O3. A comparative evaluation of the effects of premixing of solid glass microspheres with AlN/Al2O3 is also presented. The polymer composites developed with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric constant are expected to have adequate potential for a wide variety of applications particularly in microelectronic industries like electronic packaging, encapsulations, printed circuit board substrates etc.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 212 pp. Englisch.

Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The objective of the book is to report on the possibility of using ceramic fillers in polymers to make composites suitable for microelectronic applications. The first part of the book is on the development of theoretical heat conduction models for estimation of effective thermal conductivity of such polymer composites with single/hybrid fillers. The second part has provided the description of the materials used, routes adopted to fabricate the various composites and the details of the experiments. The last part has emphasized on the physical, mechanical, thermal and dielectric characteristics of all the epoxy and polypropylene based composites filled with single filler i.e. micro-sized AlN/Al2O3. A comparative evaluation of the effects of premixing of solid glass microspheres with AlN/Al2O3 is also presented. The polymer composites developed with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric constant are expected to have adequate potential for a wide variety of applications particularly in microelectronic industries like electronic packaging, encapsulations, printed circuit board substrates etc.