9783030085612 - advanced packaging and manufacturing technology based on adhesion engineering: wafer-level transfer packaging and fabrication techniques using ... (springer series in advanced manufacturing) de seok, seonho (11 resultados)
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Editorial: Springer, 2019
Serie: Libro 50 de 74 - Springer Series in Advanced Manufacturing
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Condición: New. Softcover reprint of the original 1st ed. 2018 edition NO-PA16APR2015-KAP.
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Serie: Libro 50 de 74 - Springer Series in Advanced Manufacturing
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Taschenbuch. Condición: Neu. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method | Seonho Seok | Taschenbuch | viii | Englisch | 2019 | Springer International Publishing | EAN 9783030085612 | Verantwortlich…e Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Editorial: Springer International Publishing, Springer International Publishing, 2019
Serie: Libro 50 de 74 - Springer Series in Advanced Manufacturing
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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of ben…zocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
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Editorial: Springer Nature, 2019
Serie: Libro 50 de 74 - Springer Series in Advanced Manufacturing
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Librería: Revaluation Books, Exeter, Reino UnidoRevaluation Books
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Paperback. Condición: Brand New. reprint edition. 124 pages. 9.25x6.10x0.28 inches. In Stock.
Idioma: Inglés
Editorial: Springer, 2019
Serie: Libro 50 de 74 - Springer Series in Advanced Manufacturing
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Librería: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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Condición: new. Questo è un articolo print on demand.
Idioma: Inglés
Editorial: Springer International Publishing Jan 2019, 2019
Serie: Libro 50 de 74 - Springer Series in Advanced Manufacturing
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a… function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. 124 pp. Englisch.
Idioma: Inglés
Editorial: Springer International Publishing, 2019
Serie: Libro 50 de 74 - Springer Series in Advanced Manufacturing
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Librería: moluna, Greven, Alemaniamoluna
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Introduces a new and unique packaging technologyExplains microelectromechanical systems (MEMS) packaging utilizing polymers or thin filmsDiscusses finite element method (FEM) modeling to explain the technology from a…theoretical perspective.
Idioma: Inglés
Editorial: Springer, 2019
Serie: Libro 50 de 74 - Springer Series in Advanced Manufacturing
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Librería: Majestic Books, Hounslow, Reino UnidoMajestic Books
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Condición: New. Print on Demand.
Idioma: Inglés
Editorial: Springer International Publishing, Springer International Publishing Jan 2019, 2019
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films ¿ a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a fun…ction of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load¿displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 124 pp. Englisch.
Idioma: Inglés
Editorial: Springer, 2019
Serie: Libro 50 de 74 - Springer Series in Advanced Manufacturing
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Librería: Biblios, frankfurt am main, HESSE, AlemaniaBiblios
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Condición: New. PRINT ON DEMAND.
