Librería: Chiron Media, Wallingford, Reino Unido
EUR 56,73
Cantidad disponible: Más de 20 disponibles
Añadir al carritoHardcover. Condición: New.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 67,69
Cantidad disponible: 3 disponibles
Añadir al carritoCondición: New. pp. 136.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 63,39
Cantidad disponible: 2 disponibles
Añadir al carritoHardcover. Condición: Brand New. 100 pages. 9.25x6.25x0.75 inches. In Stock.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 77,22
Cantidad disponible: 3 disponibles
Añadir al carritoCondición: New. pp. 136.
Idioma: Inglés
Publicado por ISTE Press Ltd - Elsevier Inc, 2017
ISBN 10: 1785480960 ISBN 13: 9781785480966
Librería: THE SAINT BOOKSTORE, Southport, Reino Unido
EUR 71,54
Cantidad disponible: Más de 20 disponibles
Añadir al carritoHardback. Condición: New. New copy - Usually dispatched within 4 working days.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 76,84
Cantidad disponible: 3 disponibles
Añadir al carritoCondición: New. pp. 136.
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 55,70
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: new. Questo è un articolo print on demand.
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 150,00
Cantidad disponible: 2 disponibles
Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent.Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography.This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization. Englisch.
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 154,51
Cantidad disponible: 2 disponibles
Añadir al carritoBuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent.Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography.This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization.