ISBN: 9781493921621 - more than moore technologies for next generation computer design (13 resultados)

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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as 'More than Moore' (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to 'Moore's Law'. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.…

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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as 'More than Moore' (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to 'Moore's Law'. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect. 228 pp. Englisch. …

Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as ¿More than Moore¿ (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to ¿Moore's Law¿. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 228 pp. Englisch. …

Condición: New. Print on Demand 230.

Condición: New. PRINT ON DEMAND 230.