Isbn: 9781461417279 - molecular modeling and multiscaling issues for electronic material applications (13 resultados)

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  • Idioma: Inglés

    Editorial: Springer, 2011

    1461417279 / 9781461417279

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    Librería: StainesBookhub, Weybridge, SURRE, Reino UnidoStainesBookhub

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    Condición: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

  • Idioma: Inglés

    Editorial: Springer, 2011

    1461417279 / 9781461417279

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    Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections

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    Condición: New. In English.

  • Idioma: Inglés

    Editorial: Springer, 2011

    1461417279 / 9781461417279

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    Librería: Books Puddle, Woodside, NY, Estados Unidos de AmericaBooks Puddle

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    EUR 149,99

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    Condición: New. pp. 272.

  • Idioma: Inglés

    Editorial: Springer, 2011

    1461417279 / 9781461417279

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    Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH

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    Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Molecular Modeling and Multiscaling Issues for Electronic Material Applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications. Part I presents the role that quantum mechanics can play in performance prediction, such as properties dependent upon electronic structure, but also shows examples how molecular models may be used in performance diagnostics, especially when chemistry is part of the performance issue. Part II gives examples of large-scale atomistic methods in material failure and shows several examples of transitioning between grain boundary simulations (on the atomistic level)and large-scale models including an example of the use of quasi-continuum methods that are being used to address multiscaling issues. Part III is a more specific look at molecular dynamics in the determination of the thermal conductivity of carbon-nanotubes. Part IV covers the many aspects of molecular modeling needed to understand the relationship between the molecular structure and mechanical performance of materials. Finally, Part V discusses the transitional topic of multiscale modeling and recent developments to reach the submicronscale using mesoscale models, including examples of direct scaling and parameterization from the atomistic to the coarse-grained particle level.…

  • Idioma: Inglés

    Editorial: Springer Verlag, 2011

    1461417279 / 9781461417279

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    Librería: Revaluation Books, Exeter, Reino UnidoRevaluation Books

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    Hardcover. Condición: Brand New. 267 pages. 9.25x6.25x0.50 inches. In Stock.

  • Idioma: Inglés

    Editorial: Springer New York, 2011

    1461417279 / 9781461417279

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    Librería: Buchpark, Trebbin, AlemaniaBuchpark

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    Condición: Usado - Excelente

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    Condición: Sehr gut. Zustand: Sehr gut | Seiten: 272 | Sprache: Englisch | Produktart: Bücher | Molecular Modeling and Multiscaling Issues for Electronic Material Applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications.  Part I presents  the role that quantum mechanics can play in performance prediction, such as properties dependent upon electronic structure, but also shows examples how molecular models may be used in performance diagnostics, especially when chemistry is part of the performance issue.  Part II gives examples of large-scale atomistic methods in material failure and shows several examples of transitioning between grain boundary simulations (on the atomistic level)and large-scale models including an example of the use of quasi-continuum methods that are being used to address multiscaling issues.   Part III is a more specific look at molecular dynamics in the determination of the thermal conductivity of carbon-nanotubes.   Part IV covers the many aspects of molecular modeling needed to understand the relationship between the molecular structure and mechanical performance of materials.   Finally, Part V discusses the transitional topic of multiscale modeling and recent developments to reach the submicronscale using mesoscale models, including examples of direct scaling and parameterization from the atomistic to the coarse-grained particle level.…

  • Idioma: Inglés

    Editorial: Springer, 2011

    1461417279 / 9781461417279

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    Librería: Mispah books, Redhill, SURRE, Reino UnidoMispah books

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    Condición: Usado - Como Nuevo

    EUR 182,04

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    Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

  • Idioma: Inglés

    Editorial: Springer, 2011

    1461417279 / 9781461417279

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    Librería: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand

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    Condición: new. Questo è un articolo print on demand.

  • Idioma: Inglés

    Editorial: Springer New York Dez 2011, 2011

    1461417279 / 9781461417279

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    Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.

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    Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Molecular Modeling and Multiscaling Issues for Electronic Material Applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications. Part I presents the role that quantum mechanics can play in performance prediction, such as properties dependent upon electronic structure, but also shows examples how molecular models may be used in performance diagnostics, especially when chemistry is part of the performance issue. Part II gives examples of large-scale atomistic methods in material failure and shows several examples of transitioning between grain boundary simulations (on the atomistic level)and large-scale models including an example of the use of quasi-continuum methods that are being used to address multiscaling issues. Part III is a more specific look at molecular dynamics in the determination of the thermal conductivity of carbon-nanotubes. Part IV covers the many aspects of molecular modeling needed to understand the relationship between the molecular structure and mechanical performance of materials. Finally, Part V discusses the transitional topic of multiscale modeling and recent developments to reach the submicronscale using mesoscale models, including examples of direct scaling and parameterization from the atomistic to the coarse-grained particle level. 272 pp. Englisch.…

  • Idioma: Inglés

    Editorial: Springer New York, 2011

    1461417279 / 9781461417279

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    Librería: moluna, Greven, Alemaniamoluna

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    Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Discusses multiscale modeling of materials at the mesoscaleCovers atomistic modeling of mechanical propertiesProvides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielec.…

  • Idioma: Inglés

    Editorial: Springer, 2011

    1461417279 / 9781461417279

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    Librería: Majestic Books, Hounslow, Reino UnidoMajestic Books

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    Condición: New. Print on Demand pp. 272 185 Illus.

  • Idioma: Inglés

    Editorial: Springer, 2011

    1461417279 / 9781461417279

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    Librería: Biblios, frankfurt am main, HESSE, AlemaniaBiblios

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    EUR 154,73

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    Condición: New. PRINT ON DEMAND pp. 272.

  • Idioma: Inglés

    Editorial: Springer, Springer Dez 2011, 2011

    1461417279 / 9781461417279

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    Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000

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    Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Molecular Modeling and Multiscaling Issues for Electronic Material Applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications. Part I presents the role that quantum mechanics can play in performance prediction, such as properties dependent upon electronic structure, but also shows examples how molecular models may be used in performance diagnostics, especially when chemistry is part of the performance issue. Part II gives examples of large-scale atomistic methods in material failure and shows several examples of transitioning between grain boundary simulations (on the atomistic level)and large-scale models including an example of the use of quasi-continuum methods that are being used to address multiscaling issues. Part III is a more specific look at molecular dynamics in the determination of the thermal conductivity of carbon-nanotubes. Part IV covers the many aspects of molecular modeling needed to understand the relationship between the molecular structure and mechanical performance of materials. Finally, Part V discusses the transitional topic of multiscale modeling and recent developments to reach the submicronscale using mesoscale models, including examples of direct scaling and parameterization from the atomistic to the coarse-grained particle level.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 272 pp. Englisch.…