9781119045939 - sip system-in-package design and simulation: mentor ee flow advanced design guide de li (li yang), suny (14 resultados)
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Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 155,21
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Condición: New. An advanced reference documenting, in detail, every step of a real System in Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor Graphics Expedition Enterprise Flow. Num Pages: 400 pages. BIC Classification:…TJFC. Category: (P) Professional & Vocational. Dimension: 220 x 154 x 23. Weight in Grams: 666. . 2017. Hardback. . . . .
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Librería: Rarewaves.com USA, London, LONDO, Reino UnidoRarewaves.com USA
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Hardback. Condición: New. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity,… flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies designFlipChip and RDL designRouting and coppering3D Real-Time DRC checkSiP simulation technologyMentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
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Librería: Kennys Bookstore, Olney, MD, Estados Unidos de AmericaKennys Bookstore
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EUR 194,74
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Condición: New. An advanced reference documenting, in detail, every step of a real System in Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor Graphics Expedition Enterprise Flow. Num Pages: 400 pages. BIC Classification:…TJFC. Category: (P) Professional & Vocational. Dimension: 220 x 154 x 23. Weight in Grams: 666. . 2017. Hardback. . . . . Books ship from the US and Ireland.
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Librería: moluna, Greven, Alemaniamoluna
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Gebunden. Condición: New. Mr. Suny Li (Li Yang) is a SiP/PCB Technical Specialist in China he now works in AcconSys Technology Co. Ltd, (a Mentor Authorized Distributor for China). Suny has guided and consulted on dozens of SiP projects in China, accumulating plentiful experience i.
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Librería: Revaluation Books, Exeter, Reino UnidoRevaluation Books
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Hardcover. Condición: Brand New. 400 pages. 8.66x6.08x0.88 inches. In Stock.
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Librería: Rarewaves.com UK, London, Reino UnidoRarewaves.com UK
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Hardback. Condición: New. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity,… flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies designFlipChip and RDL designRouting and coppering3D Real-Time DRC checkSiP simulation technologyMentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
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Librería: Biblios, frankfurt am main, HESSE, AlemaniaBiblios
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EUR 243,97
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Hardcover. Condición: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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HRD. Condición: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Hardcover. Condición: new. Hardcover. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die sta…cks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies designFlipChip and RDL designRouting and coppering3D Real-Time DRC checkSiP simulation technologyMentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Librería: Majestic Books, Hounslow, Reino UnidoMajestic Books
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