ISBN: 9780470827802 - modeling and simulation for microelectronic packaging assembly: manufacturing, reliability and testing (14 resultados)

Condición: New.

Condición: New. pp. xxii + 564 Index.

Condición: New. pp. xxii + 564 Illus.

Condición: As New. Unread book in perfect condition.

Condición: New.

Condición: As New. Unread book in perfect condition.

Condición: New.

Gebunden. Condición: New. Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming test and try out method to obtain the best solution. Modeling and sim.

Buch. Condición: Neu. Neuware.

Condición: New. An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing. Num Pages: 592 pages, Illustrations. BIC Classification: TGP; TJF. Category: (P) Professional & Vocational. Dimension: 254 x 174 x 35. Weight in Grams: 1136. . 2011. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.…

Condición: New. An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing. Num Pages: 592 pages, Illustrations. BIC Classification: TGP; TJF. Category: (P) Professional & Vocational. Dimension: 254 x 174 x 35. Weight in Grams: 1136. . 2011. 1st Edition. hardcover. . . . .…

HRD. Condición: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Hardcover. Condición: new. Hardcover. Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first timeProvides the skills necessary for virtual prototyping and virtual reliability qualification and testingDemonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic productsCovers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnectsAppendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Condición: New. PRINT ON DEMAND pp. xxii + 564 Acknowledgements.