9780470748244 - failure analysis: a practical guide for manufacturers of electronic components and systems: 4 (quality and reliability engineering series) de bazu, marius (21 resultados)
Idioma: Inglés
Editorial: Wiley, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: PBShop.store UK, Fairford, GLOS, Reino UnidoPBShop.store UK
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EUR 98,62
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HRD. Condición: New. New Book. Shipped from UK. Established seller since 2000.
Idioma: Inglés
Editorial: Wiley, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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EUR 97,46
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Idioma: Inglés
Editorial: Wiley, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Idioma: Inglés
Editorial: Wiley, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: World of Books (was SecondSale), Montgomery, IL, Estados Unidos de AmericaWorld of Books (was SecondSale)
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EUR 109,10
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Condición: Very Good. Item in very good condition! Textbooks may not include supplemental items i.e. CDs, access codes etc.
Idioma: Inglés
Editorial: Wiley, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: GreatBookPrices, Columbia, MD, Estados Unidos de AmericaGreatBookPrices
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EUR 108,46
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Idioma: Inglés
Editorial: Wiley, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: GreatBookPricesUK, Woodford Green, Reino UnidoGreatBookPricesUK
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EUR 98,61
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Idioma: Inglés
Editorial: Wiley, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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EUR 100,97
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Idioma: Inglés
Editorial: Wiley, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: GreatBookPricesUK, Woodford Green, Reino UnidoGreatBookPricesUK
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EUR 108,84
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Condición: As New. Unread book in perfect condition.
Idioma: Inglés
Editorial: John Wiley and Sons Inc, US, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: Rarewaves.com USA, London, LONDO, Reino UnidoRarewaves.com USA
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EUR 131,70
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Hardback. Condición: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices an…d processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Idioma: Inglés
Editorial: Wiley, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: California Books, Miami, FL, Estados Unidos de AmericaCalifornia Books
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EUR 134,60
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Condición: New.
Idioma: Inglés
Editorial: John Wiley & Sons, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: Majestic Books, Hounslow, Reino UnidoMajestic Books
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EUR 129,52
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Condición: New. pp. xxii + 317 Illus.
Idioma: Inglés
Editorial: John Wiley & Sons Inc, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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- Primera edición
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 124,66
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Condición: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processe…s. Series: Quality and Reliability Engineering Series. Num Pages: 340 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 249 x 177 x 22. Weight in Grams: 754. . 2011. 1st Edition. Hardcover. . . . .
Idioma: Inglés
Editorial: John Wiley & Sons, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: Books Puddle, New York, NY, Estados Unidos de AmericaBooks Puddle
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EUR 147,43
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Condición: New. pp. xxii + 317.
Idioma: Inglés
Editorial: John Wiley & Sons, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: moluna, Greven, Alemaniamoluna
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EUR 111,01
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Gebunden. Condición: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously imp.
Idioma: Inglés
Editorial: John Wiley & Sons Inc, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: Kennys Bookstore, Olney, MD, Estados Unidos de AmericaKennys Bookstore
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EUR 158,86
Envío por EUR 9,21Se envía dentro de Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processe…s. Series: Quality and Reliability Engineering Series. Num Pages: 340 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 249 x 177 x 22. Weight in Grams: 754. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
Idioma: Inglés
Editorial: John Wiley & Sons Inc, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: Revaluation Books, Exeter, Reino UnidoRevaluation Books
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EUR 178,84
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Hardcover. Condición: Brand New. 1st edition. 344 pages. 10.00x6.00x0.75 inches. In Stock.
Idioma: Inglés
Editorial: John Wiley and Sons Inc, US, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: Rarewaves.com UK, London, Reino UnidoRarewaves.com UK
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EUR 123,00
Envío por EUR 76,27Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Hardback. Condición: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices an…d processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Idioma: Inglés
Editorial: Wiley Apr 2011, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 137,13
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Buch. Condición: Neu. Neuware - Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devi…ces and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal.Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use.Inside you will find detailed coverage on:\* a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved\* the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions\* the design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability)\* failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability\* reliability resting after fabrication, including reliability assessment at this stage and corrective actions\* a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods\* new challenges in reliability testing, such as its use in microsystems and nanostructuresThis practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Idioma: Inglés
Editorial: John Wiley & Sons Inc, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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Librería: THE SAINT BOOKSTORE, Southport, Reino UnidoTHE SAINT BOOKSTORE
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EUR 118,43
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Hardback. Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Idioma: Inglés
Editorial: John Wiley & Sons Inc, New York, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
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- Primera edición
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Librería: CitiRetail, Stevenage, Reino UnidoCitiRetail
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EUR 108,76
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Hardcover. Condición: new. Hardcover. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials…, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Idioma: Inglés
Editorial: John Wiley & Sons Inc, 2011
Serie: Quality and Reliability Engineering, Libro 2 de 19. Libro 2 de 19 - Quality and Reliability Engineering
- Tapa dura
- Impresión bajo demanda
Librería: Revaluation Books, Exeter, Reino UnidoRevaluation Books
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EUR 138,06
Envío por EUR 14,67Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 2 disponibles
Hardcover. Condición: Brand New. 1st edition. 344 pages. 10.00x6.00x0.75 inches. In Stock. This item is printed on demand.
