Isbn: 9780442012366 - multichip module technologies and alternatives: the basics (14 resultados)

Hardcover. Condición: As New. No Jacket. 1st Edition. This is a fine, as new, hardcover first edition copy, no DJ, blue spine. 875 pages with index. Photos on request.

Condición: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.…

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Condición: good. Book shows wear from use but remains a usable copy. May include writing highlighting underlining library markings. LISTING USES STOCK PHOTOS AND COVER MAY VARY. Ships via USPS and typically arrives within 10-12 business days.

Condición: Like New. Used - Like New. Book is new and unread but may have minor shelf wear. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

paperback. Condición: New. In shrink wrap. Looks like an interesting title.

Condición: New. In English.

Condición: New.

Condición: New. Provides a framework for understanding the multichip module (MCM) technologies available for package selection. This book is useful for engineers concerned with the design and systems integration of products and technical managers who decide how to apply to technologies. Num Pages: 875 pages, biography. BIC Classification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 55. Weight in Grams: 1500. . 1992. Hardback. . . . . …

Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condición: As New. Unread book in perfect condition.

Gebunden. Condición: New. Far from being the passive containers for semiconductor devices of the past, the packages in today s high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance me.

Condición: New. Provides a framework for understanding the multichip module (MCM) technologies available for package selection. This book is useful for engineers concerned with the design and systems integration of products and technical managers who decide how to apply to technologies. Num Pages: 875 pages, biography. BIC Classification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 55. Weight in Grams: 1500. . 1992. Hardback. . . . . Books ship from the US and Ireland. …

Taschenbuch. Condición: Neu. Neuware - Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.…