9780442012366 - multichip module technologies and alternatives: the basics de doane, daryl ann; franzon, paul (10 resultados)
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Librería: -OnTimeBooks-, Phoenix, AZ, Estados Unidos de America-OnTimeBooks-
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Condición: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipp…ed with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.
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Librería: HPB-Red, Dallas, TX, Estados Unidos de AmericaHPB-Red
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paperback. Condición: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
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Librería: BennettBooksLtd, Los Angeles, CA, Estados Unidos de AmericaBennettBooksLtd
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paperback. Condición: New. In shrink wrap. Looks like an interesting title.
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Condición: Like New. Used - Like New. Book is new and unread but may have minor shelf wear. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
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Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 257,99
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Condición: New. Provides a framework for understanding the multichip module (MCM) technologies available for package selection. This book is useful for engineers concerned with the design and systems integration of products and technical managers who decide how to apply to technologies. Num Pages: 875 pages, biography. BIC Class…ification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 55. Weight in Grams: 1500. . 1992. Hardback. . . . .
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Librería: moluna, Greven, , Alemaniamoluna
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Gebunden. Condición: New. Far from being the passive containers for semiconductor devices of the past, the packages in today s high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance me.
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Librería: Mispah books, Redhill, SURRE, Reino UnidoMispah books
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Hardcover. Condición: Like New. Like New. book.
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Librería: Kennys Bookstore, Olney, MD, Estados Unidos de AmericaKennys Bookstore
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EUR 323,47
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Condición: New. Provides a framework for understanding the multichip module (MCM) technologies available for package selection. This book is useful for engineers concerned with the design and systems integration of products and technical managers who decide how to apply to technologies. Num Pages: 875 pages, biography. BIC Class…ification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 55. Weight in Grams: 1500. . 1992. Hardback. . . . . Books ship from the US and Ireland.
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 305,57
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Taschenbuch. Condición: Neu. Neuware - Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to… improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
