Multichip Module Technologies and Alternatives: The Basics - Tapa blanda

Doane, Daryl Ann; Franzon, Paul

 
9780442012366: Multichip Module Technologies and Alternatives: The Basics
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ISBN 10: 0442012365 ISBN 13: 9780442012366
Editorial: Springer, 1992

Sinopsis

Far from being the passive containers for semiconductor devices of the past, the packages in today’s high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

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Reseña del editor

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Reseña del editor

The first book to provide a framework for understanding the multichip module (MCM) technologies available for package selection. This volume will be relied on by engineers concerned with the design and systems integration of new products and technical managers who decide how to apply to new technologies.

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Editorial
Springer
Año de publicación
1992
Idioma
Inglés
ISBN 10 
0442012365
ISBN 13 
9780442012366
Encuadernación
Tapa blanda
Número de páginas
912
Contacto del fabricante
no disponible
Persona responsable
CMN Printpool Inh. Mathis Neumann
https://www.also.com/ec/cms5/en_6000/6000/index.jsp

Friedrich-Karl-Str. 9
Hamburg
Alemania

Otras ediciones populares con el mismo título

9781461363552: Multichip Module Technologies and Alternatives: The Basics

Edición Destacada

ISBN 10:  1461363551 ISBN 13:  9781461363552
Editorial: Springer-Verlag New York Inc., 2014
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