ISBN: 9780442002602 - solder joint reliability: theory and applications (20 resultados)

Hardcover. Condición: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

hardcover. Condición: Good. Satisfaction 100% guaranteed.

Hardcover. Condición: As New. No Jacket. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less.

hardcover. Condición: new.

hardcover. Condición: New. In shrink wrap. Looks like an interesting title.

Hardcover. Condición: Very Good. 1st Edition. This book has been read, but is in a clean and very good condition. All pages are intact with no highlighting or writing contained within. The spine remains undamaged with tight binding. Fast dispatch within and from the UK. 100% money back guarantee.

Dura. Condición: New. Estado de la sobrecubierta: Nuevo. 0. Predicting and engineering reliable solder joints in today?s complex electronic packaging and interconnection is both critical and extremely difficult. Compoundig this difficulty is that the latest information on how to prevent solder failure has been available only from proceedings of many scattered conferences, symposia, and workshops. This as well as immensely practical, this guide compiles state-of-the-art techniques spanning the full scope of solder reliability concerns. It offers contributions from a widerange of experts who address their respective specialties covering the most advanced research and solutions technology in the field today. You?ll the brains of industry leaders in discussions of the underlying science and practical consideration of every primary cause of solder failure. Progressing from solder joint formation to long-term reliability, the contributors explain how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Failure mechanisms of bulk solders and joints under mechanical, isothermal, and thermal conditions are explored in depth. 1000 gr. No Aplica (ilustrador). Libro.…

Condición: As New. Unread book in perfect condition.

Condición: New.

Condición: New. pp. 656.

Condición: New.

Condición: New. Featuring the contributions of industrial academic experts in this area of electronics packaging, this volume examines solder failure - one of the reliability problems facing the modern surface-mounted electronics. Num Pages: 631 pages, 146 black & white illustrations, biography. BIC Classification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 34. Weight in Grams: 2400. . 1991. Hardback. . . . .…

Condición: New.

Condición: New. pp. 656 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Condición: New. In English.

Condición: As New. Unread book in perfect condition.

Condición: New. Featuring the contributions of industrial academic experts in this area of electronics packaging, this volume examines solder failure - one of the reliability problems facing the modern surface-mounted electronics. Num Pages: 631 pages, 146 black & white illustrations, biography. BIC Classification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 34. Weight in Grams: 2400. . 1991. Hardback. . . . . Books ship from the US and Ireland.…

Hardcover. Condición: Near Fine. hardback book in near fine condition,name stamped on first blank page.

Buch. Condición: Neu. Neuware - Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical 'glue' of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.…

Condición: New. PRINT ON DEMAND pp. 656.