vinay divakar (21 resultados)

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Paperback or Softback. Condición: New. Mechanical Aspects in Electronics Systems Design. Book.

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Taschenbuch. Condición: Neu. Neuware -Master's Thesis from the year 2014 in the subject Engineering - Naval Engineering, Ocean Engineering, , course: Electronics Systems Design, language: English, abstract: The existing underwater acoustic modems are designed for deep oceans and long range communication leading to immense consumption of power and high cost. These long range underwater acoustic modems are not suitable choice for deployment in underwater sensor networks, Hence the problem was chosen to design and develop a underwater acoustic modems that operates in shallow waters of depth below 100m and for a short range of below 100 m. Underwater wireless sensor network is contemporary technology that can be applied in the fields of security, surveillance, military, commercial, industrial and environmental. The major drawback is that the traditional underwater acoustic modems cannot be deployed for underwater sensor networks. This work focusses on the research and development of the underwater acoustic modem for shallow waters and short range communication. The relevant background theory required understand acoustics and for modelling the unique characteristics of the underwater channel is described in detail. Different concepts to model and implement the functionalities of the transmitter and receiver were explored, while converging to the most suitable choice of concepts. The modelled system is simulated for different channel conditions such as depth, range and induced ambient noise. The results were analysed in order to conclude the performance outcome of the system. The modelled system can efficiently operate for a depth of 30m, 50m and 70m for a range up to 50m. The hardware was developed using minimum number of components as a proof of concept for efficient data transmission and reception using acoustic signals. The hardware was tested to operate efficiently in air, however hardware tests for underwater is suggested for future work, which wi 92 pp. Englisch.

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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described.Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail.Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.

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Taschenbuch. Condición: Neu. Mechanical Aspects in Electronics Systems Design | Vinay Divakar | Taschenbuch | 36 S. | Englisch | 2014 | GRIN Verlag | EAN 9783656730903 | Verantwortliche Person für die EU: GRIN Publishing GmbH, Waltherstr. 23, 80337 München, info[at]grin[dot]com | Anbieter: preigu.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Master's Thesis from the year 2014 in the subject Engineering - Naval Engineering, Ocean Engineering, , course: Electronics Systems Design, language: English, abstract: The existing underwater acoustic modems are designed for deep oceans and long range communication leading to immense consumption of power and high cost. These long range underwater acoustic modems are not suitable choice for deployment in underwater sensor networks, Hence the problem was chosen to design and develop a underwater acoustic modems that operates in shallow waters of depth below 100m and for a short range of below 100 m. Underwater wireless sensor network is contemporary technology that can be applied in the fields of security, surveillance, military, commercial, industrial and environmental. The major drawback is that the traditional underwater acoustic modems cannot be deployed for underwater sensor networks. This work focusses on the research and development of the underwater acoustic modem for shallow waters and short range communication. The relevant background theory required understand acoustics and for modelling the unique characteristics of the underwater channel is described in detail. Different concepts to model and implement the functionalities of the transmitter and receiver were explored, while converging to the most suitable choice of concepts. The modelled system is simulated for different channel conditions such as depth, range and induced ambient noise. The results were analysed in order to conclude the performance outcome of the system. The modelled system can efficiently operate for a depth of 30m, 50m and 70m for a range up to 50m. The hardware was developed using minimum number of components as a proof of concept for efficient data transmission and reception using acoustic signals. The hardware was tested to operate efficiently in air, however hardware tests for underwater is suggested for future work, which wi.

Taschenbuch. Condición: Neu. Design and Development of Underwater Acoustic Modem for Shallow Waters and Short Range Communication | Vinay Divakar | Taschenbuch | 92 S. | Englisch | 2014 | GRIN Verlag | EAN 9783656735328 | Verantwortliche Person für die EU: GRIN Publishing GmbH, Waltherstr. 23, 80337 München, info[at]grin[dot]com | Anbieter: preigu.

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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described.Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail.Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail. 36 pp. Englisch.

Condición: New. Print on Demand pp. 36 424:B&W 5.83 x 8.27 in or 210 x 148 mm (A5) Perfect Bound on Creme w/Matte Lam.

Condición: New. Print on Demand pp. 36.

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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described.Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.Books on Demand GmbH, Überseering 33, 22297 Hamburg 36 pp. Englisch.